About 3D NAND Flash Memory
3D NAND is developed to overcome 2D NAND’s capacity limitations. It scales to higher densities without sacrificing data integrity. This market has a high demand in enterprises for the replacement of hard disk drives by providing higher storage capacity. The use of TSV technology providing high data rates for low latency. The 3D NAND is moving to the quad-level cell, which is the next step in cell storage density, as a step towards a denser storage system. The technology is a type of flash storage that uses a layered design to increase its maximum chip capacity.
Attributes | Details |
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Study Period | 2020-2032 |
Base Year | 2024 |
Unit | Value (USD Million) |
In This Market Players Are Focusing Technology Advancement In Their Offerings Such Involving Artificial Intelligence To Boost Their Productivity Of Products. And Also Working On Layers Developments To Increase The Storage Capacity, Which Helps To Improve Their Market Reach. Analyst at AMA Research estimates that Asia Pacific, United States Players will contribute the maximum growth to Global 3D NAND Flash Memory market throughout the forecasted period. Established and emerging Players should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Samsung Electronics Co. (South Korea), Toshiba Corporation (Japan), SK Hynix Semiconductor (South Korea), Micron Technology (United States), Intel Corporation (United States), Apple Inc. (United States), Lenovo Group Ltd. (Hong Kong), Advanced Micro Devices (United States), STMicroelectronics (Switzerland) and SanDisk Corporation (United States) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research coverage are Pure Storage (United States).
Segmentation Overview
AMA Research has segmented the market of Global 3D NAND Flash Memory market by Type (Single-Level Cell, Multi-Level Cell and Triple-Level Cell), Application (Cameras, Laptop & Pcs, Smartphones & Tablets, Others, Hyperconverged Infrastructure (HCI) and High-Capacity Environments) and Region.
On the basis of geography, the market of 3D NAND Flash Memory has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Verticals, the sub-segment i.e. Automotive will boost the 3D NAND Flash Memory market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Increase Demand for Smaller Memory Chips, Due Advancement in Electronic Products
Market Growth Drivers:
Increase Demand for Cloud Connected Devices, Increase In Demand for Data Storage across Consumer Electronics and Enterprise Storage Sectors and High Incorporations Internet of Things in Multiple Applications
Challenges:
3D NAND Needs More Silicon and Shortages and Supply Chain Issues
Restraints:
High and Complex Manufacturing Cost Is Become the Barrier for This Market
Opportunities:
High Potential Growth in This Market by Providing Higher Capacity of Storage and Improved Power Efficiency for Increasing Demand in Consumer Electronics
Market Leaders and their expansionary development strategies
In January 2019, Micron Exercises Call Option to Acquire Remaining Interest in IM Flash Technologies Joint Venture IM Flash Technologies, LLC.
In Jan 2019, Samsung Announced Its New 96-Layer 3D NAND Flash Memory in the Form of the 970 EVO Plus. It Is Updated Version Of Samsung 970 EVO And Having New NAND Chips. It Is Available In Capacities Of 250 GB, 500 GB, TB And 2 TB. Additionally, In 2019 Only Toshiba Announced The Starting Of Construction Of Its New BICs 3D NAND Flash Memory Fab Located In Japan. It Is Defined As New Method Involves Artificial Intelligence To Boost Productivity.
Key Target Audience
Venture Capitalists and Private Equity Firms, New Entrants/Investors, Analysts and Strategic Business Planners, 3D NAND Flash Memory Manufacturers, Suppliers and Distributors, Government Regulatory and Research Organizations and End-Use Industries
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.