About Interposer
An interposer is an electrical interface whose main objective is to reroute one connection to a different connection. It helps in higher-level integration and enables a greater number of external contacts by the electrical devices. It also facilitates increased speed, improved electrical and thermal performance, and more interconnections. Interposers provide a much larger channel for electrical signals, thereby reducing the amount of energy needed to drive those signals. It also minimizes the resistance/capacitance (RC) delay and shortens the distance between various IP blocks in a system and the memories associated with them.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
The companies are exploring the market by adopting mergers & acquisitions, expansions, investments, new service launches and collaborations as their preferred strategies. The players are exploring new geographies through expansions and acquisitions to avail a competitive advantage through combined synergies. Analyst at AMA Research estimates that United States Players will contribute the maximum growth to Global Interposer market throughout the forecasted period. Established and emerging Players should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
United Microelectronics Corporation (Taiwan), ASE Technology Holding Co., Ltd. (Taiwan), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Intel Corporation (United States), Amkor Technology (United States), Toshiba Corporation (Japan), Broadcom Inc. (United States), Samsung Electronics Co., Ltd. (South Korea) and Texas Instruments Incorporated (United States) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research coverage are Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Murata Manufacturing Co., Ltd. (Japan), ALLVIA, Inc. (United States), STATS ChipPAC Pte. Ltd. (Singapore) and UTAC Group (Singapore).
Segmentation Overview
AMA Research has segmented the market of Global Interposer market by , Application (Communication Systems, Network and Signal Processing, RF and Opto-electronics, MEMS and Sensor, Power and Analog Devices and Others (CPU, GPU)) and Region.
On the basis of geography, the market of Interposer has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Raw Material, the sub-segment i.e. Silicon will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Industry Vertical, the sub-segment i.e. Electrical & Electronics will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Sales Channel, the sub-segment i.e. Online will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Packaging Technology, the sub-segment i.e. 2D Interposer will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
The Growing Trend of Miniaturization of Electronic Devices Such As Mobile Phones, Tablets, and Gaming Devices and Growing Demand of Through-silicon Vias (TSV) for Transmission of Signals
Market Growth Drivers:
Growing Demand from End-Use Industries Such As Consumer Electronics and Military & Defense Sector Due To the Need for Higher I/O Density and Specific Performance Requirements, Increasing Demand for High-performance Computing Systems, The Surge in the Demand of Advanced Wafer Level Packaging Technologies in Sensors and MEMEs and The Rise in the Use of Connected and Wearable Devices
Challenges:
Performance, and Cost Barriers Induced By the Interposer Materials, Performance Limitations of Silicon Interposer and Manufacturing Challenges Such As Surface Defects That Leads To Cracking
Restraints:
High Cost than Conventional Packaging which Limits 2.5D to High-end Applications
Opportunities:
Growing Technological Developments such as the Internet of Things (IoT) and Connected and Self-Driving Cars Owing To the Requirement of Higher Bandwidth Data Processing and Communications and Increasing Research Activities in the Field of Material Technology Such As Glass Interposers, And Advancements in Packaging to Lower Cost
Market Leaders and their expansionary development strategies
In November 2022, Indiana Regional Economic Acceleration and Development Initiative (READI) announced the establishment of a new microelectronics campus at WestGate Crane Technology Park (WestGate). The center is funded by four companies including NHanced Semiconductors to expand the semiconductor industry in the region. NHanced Semiconductors invested more than USD 236 million to develop 2.5D, silicon interposers, and 3D-ICs for the expansion of the semiconductor market.
On November 30, 2020, Broadcom Inc. has announced sampling of its 5nm ASIC device for data center and cloud infrastructure. Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology.
Key Target Audience
Interposer Manufacturers, Consumer Electronics Manufacturers, Raw Material Suppliers, Automobile and Defense Organization, End-Use Industries and Others
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.