What is BLE Module Market?
BLE Module provides interoperable wireless connectivity to compact battery-operated applications, additionally at low cost. It is a wireless protocol operating in the 2.4 GHz ISM band, with up to 1.4 Mbps application throughput or up to 1,000 m range. The technology is highly effective, minimizing the energy needed to transfer data. It is secure, specifying features to ensure confidentiality, integrity, and privacy. Bluetooth LE is now standardized in all smartphones, tablets, and laptops, in addition to, a wide range of other devices. It has support in iOS and Android, as well as macOS, Windows 10, and Linux. The accelerated growth of the IoT market is one of the major factors driving the global BLE module market over the forecast period.
Highlights from BLE Module Market Study
Attributes | Details |
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Study Period | 2018-2028 |
Base Year | 2022 |
Unit | Value (USD Million) |
Key Companies Profiled | Nordic Semiconductor (Norway), Qualcomm Incorporated (United States), NXP Semiconductors N.V. (Netherlands), Texas Instruments Incorporated (United States), Microchip Technology Inc. (United States), Cypress Semiconductor Corporation (United States), Argenox Technologies LLC (United States), Silicon Laboratories, Inc. (United States), Semtech Corporation (United States) and Redpine Signals, Inc. (United States) |
Manufacturers can focus on developing new and innovative products that offer better performance, lower power consumption, and smaller form factors. This can help them to differentiate themselves from their competitors and capture a larger market share.The Players having a strong hold in the market are Nordic Semiconductor, Qualcomm Incorporated, NXP Semiconductors N.V., and Texas Instruments Incorporated. Research Analyst at AMA predicts that United States Players will contribute to the maximum growth of Global BLE Module market throughout the forecasted period.
Nordic Semiconductor (Norway), Qualcomm Incorporated (United States), NXP Semiconductors N.V. (Netherlands), Texas Instruments Incorporated (United States), Microchip Technology Inc. (United States), Cypress Semiconductor Corporation (United States), Argenox Technologies LLC (United States), Silicon Laboratories, Inc. (United States), Semtech Corporation (United States) and Redpine Signals, Inc. (United States) are some of the key players profiled in the study. Additionally, the Players which are also part of the research are STMicroelectronics (Switzerland) and Marvell Technology Group (United States). BLE Module Market Segmentation:
Scope | Sub-Segments |
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Application / End User | Computing Devices, Smart Wearables, Smart Home Appliances and Others |
Type | Single-Mode BLE Modules and Dual-Mode BLE Modules |
End Use Verticals | Manufacturing,Automotive,Telecommunication,Home Appliances,Others |
Network Topology | Central Device,Peripheral Device |
On the basis of geography, the market of BLE Module has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Rising Use of Powerful Single-chip Low Consumption Wireless Devices
Market Growth Drivers:
Rising Adoption of the Internet of Things (IoT) Globally and Increasing Digital Literacy and Digitalization in Emerging Economies
Challenges:
Technical Discrepancies Coupled With Lower Data Streaming Capabilities of BLE Moduls and Increasing Privacy Concerns
Restraints:
Robust Competitive Rivalry Might Stagnant Demand of the BLE Module
Opportunities:
Growing Number of Applications for BLE Modules in Smart Home Appliances Creates Opportunities
Key Target Audience
BLE Module Manufacturers, Potential Technology Investors, Regulatory & Government Bodies, Downstream Vendors and Other
Market Leaders & Development Strategies
On 31, July 2019, u‑blox announced that it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is a leading provider of Edge-as-a-Service gateway solutions for Commercial IoT and began offering certified wireless modules in 2015. This acquisition will allow u‑blox to extend its range of products in the area of Bluetooth low energy, Zigbee, and Thread, as well as to access additional market segments and channels.
In June 2022, With the addition of the AIROCTM CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip (SoC), Infineon Technologies AG increased its AIROC Bluetooth portfolio.