Industry Background:
A heat sink is a component that increases the heat flow away from a hot device. Heat will naturally travel through the heat sink via natural conduction moving across the thermal gradient from a high temperature to a low-temperature environment. Heat moves away from the heat sink. This process relies on the heat sink's temperature gradient and its working fluid-most commonly air or a non-electrically-conductive liquid. Growing Demand for Computers in School Colleges is Fueling the Growth. Increasing Use of Copper and Aluminum are most common in the Construction of Heat Sinks.
The Global Thermal Interface Portion Of Heat Sink market presents a comprehensive analysis of the Thermal Interface Portion Of Heat Sink market by product type (Polymer-based TIM, PC (phase change) TIM and Metal-based TIM), and by geography (North America, South America, Europe, Asia-Pacific and MEA) along with country level break-up. The key Manufacturers profiled in the report are Shin-Etsu Cmemical (Japan), Dow Corning (United States), Akasa Thermal Solution (United States), Indium Corporation (United States), Aavid Thermalloy (United States), Honeywell International (United States), Arctic Silver (United States), Enerdyne Solutions (United States), 3M (United States), Ametek Specialty Metal Products (United States), Wakefield-Vette (United States), AOS Thermal Compounds (United States), Lord Corporation (United States) and Master Bond (United States). Additionally, other players that are part of this comprehensive study are Ai Technology (United States), LairdTech (United States), Zalman Tech (South Korea), Parker Chomerics (United States), Momentive (United States), Henkel (Germany) and Stockwell Elastomerics (Germany).
Attributes | Details |
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Study Period | 2017-2027 |
Base Year | 2021 |
Forecast Period | 2022-2027 |
Historical Period | 2017-2021 |
Unit | Value (USD Million) |
Key Companies Profiled | Shin-Etsu Cmemical (Japan), Dow Corning (United States), Akasa Thermal Solution (United States), Indium Corporation (United States), Aavid Thermalloy (United States), Honeywell International (United States), Arctic Silver (United States), Enerdyne Solutions (United States), 3M (United States), Ametek Specialty Metal Products (United States), Wakefield-Vette (United States), AOS Thermal Compounds (United States), Lord Corporation (United States) and Master Bond (United States) |
Customization Scope | Avail customization with purchase of this report. Add or modify country, region & or narrow down segments in the final scope subject to feasibility |
Influencing Trend:
Growing Trend reworkability, low cost, low thermal resistance, and ability to form ultra-thin bond lines and Increasing Trend for Passenger Cars over the Upcoming Year
Market Growth Drivers:
Growing Demand for Computers in School Colleges is Fueling the Growth and Increasing Use of Copper and Aluminum are most Common in the Construction of Heat Sinks
Challenges:
Challenge of Reducing Cost and Providing value in Sales Enablement
Restraints:
Rapidly Changing in Consumer Preferences is projected to limit the Growth through forecast period
Opportunities:
Growing Demand of automobile and mobile device manufacturing development in China, Taiwan, South Korea, Japan, and India and Increasing Technology and Innovations in Thermal Interface Portion of Heat Sink
Regional Breakdown and Segment Analysis
This section of our report presents a realistic picture of the Global Thermal Interface Portion Of Heat Sink industry. Investors and manufacturers can easily understand the inherent opportunities and challenges for their products in the geographical region of interest.
The By End User, such as Automobile Industry, is boosting the Thermal Interface Portion Of Heat Sink market and is anticipated to experience a steady growth during the forecast period.
The By Material, such as Copper Heat Sink, is boosting the Thermal Interface Portion Of Heat Sink market and is anticipated to experience a steady growth during the forecast period.
The By Mounting Type, such as PIN based, is boosting the Thermal Interface Portion Of Heat Sink market and is anticipated to experience a steady growth during the forecast period.
The key manufacturers are targeting the innovations of the products with better quality, better technical characteristics, and also assist in providing and humanizing the after-sale service to the consumers. The key players are probable to keep a stronghold on the market over the anticipated period. The key players are accepting strategic decisions and are thinking upon mergers and acquisitions in order to maintain their presence in the market.
The regional segmentation covered in this report are:
South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico)