About Dry Etching Machine
Dry etching mainly refers to the elimination of material, which is typically a masked model of semiconductor material, by the means of exposing the material to a flood of ions (usually plasma of reactive gases such as fluorocarbons, oxygen, chlorine, and boron trichloride, sometimes with the expansion of nitrogen, argon, helium, and some other gases) that displace some parts of the material from the exposed surface. The popular type of dry etching is reactive ion etching. In contrast, to various (but not all, see isotropic etching) of the wet chemical etching agents used in wet etching, the dry etching process typically etches in a directional or anisotropic manner. Dry etching is particularly useful for materials and semiconductors that are chemically repellent and cannot be wetly etched, such as silicon carbide or gallium nitride. The dry etching machine design mainly includes a vacuum chamber, a dedicated gas supply system, an RF waveform generator, and an exhaust system. Dry etching is also used in combination with photolithographic techniques to treat certain areas of a semiconductor surface to form openings in the material, such as e.g. connecting holes (which are connections to the underlying semiconductor substrate) or via holes (which are holes that are formed to provide a connection path between conductive layers in the laminated semiconductor device) or otherwise to eliminate many semiconductor layers with predominantly vertical sides be requested.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
The companies are exploring the market by adopting expansions, investments, new service launches, and collaborations as their preferred strategies. The players are exploring new geographies through expansions and acquisitions across the globe to avail of competitive advantage through combined collaborations. Analyst at AMA Research estimates that Japanese Manufacturers will contribute the maximum growth to Global Dry Etching Machine market throughout the forecasted period. Established and emerging Manufacturers should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Applied Materials (United States), Lam Research (United States), Hitachi High-Technologies Corporation (Japan), Suzhou Delphi Laser Co. Ltd. (Japan), EV Group (United States), DISCO Corporation (Japan), Plasma-Therm, LLC (United States), Tokyo Electron Ltd. (Japan), Advanced Dicing Technologies (Israel) and Panasonic Corporation (Japan) are some of the key players that are part of study coverage.
Segmentation Overview
AMA Research has segmented the market of Global Dry Etching Machine market by Type (Conductor Etching, Dielectric Etching and Polysilicon Etching), Application (Biomedical Applications, Material Industry, Semiconductors Industry and Surface Treatment) and Region.
On the basis of geography, the market of Dry Etching Machine has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Features, the sub-segment i.e. Easy To Start and Stop will boost the Dry Etching Machine market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by End-Use, the sub-segment i.e. Logic and Memory will boost the Dry Etching Machine market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Rising Demand for AI in the Dry Etching Machine
Market Growth Drivers:
The Strong Demand for MEMS from the Automotive Industry and Growing Demand for Smartphones and Tablets
Challenges:
The Demand from the Different End-Users Segment
Restraints:
Strict Regulation Regarding E-waste
Opportunities:
Increasing Demand for the Contract, Energy-Efficient, and Electronic Devices and The Rapid Technological Advancement
In March 2021, Tokyo Electron (TEL) has launched of Impressio 1800 PICP Pro and Betelex 1800 PICP Pro, the company’s latest plasma etch systems featuring the new PICP Pro chamber for high resolution processing of 6th generation (G6: 1,500 mm x 1,850 mm) glass substrates.
Key Target Audience
New Entrants/Investors, Analysts and Strategic Business Planners, Government Regulatory, Enterprise Users, Commercial Users and Industrial Users
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.