About 3D Ics
It is known as three-dimensional integrated circuit which is having two or more layers, it is highly utilized in the electronics industry. It is using on-chip signaling, whether vertically or horizontally. With the growth in computer and information technology and their increasing dependency on VLSI. Along with that 3D chips also overcome with limitations for 2D ICs such as delays and high-power consumption. The 3D ICs include various benefits including interconnect performance, enhance transistor packing density, power dissipation, and others.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
CAGR | 6.6% |
The global 3D Ics market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market Analyst at AMA Research estimates that United States Players will contribute the maximum growth to Global 3D Ics market throughout the forecasted period. Established and emerging Players should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
XILINX (United States), Taiwan Semiconductor Manufacturing Company (Taiwan), The 3M Company (United States), Tezzaron Semiconductor Corporation (United States), STATS ChipPAC (China), Ziptronix (United States) and Samsung Electronics Co.Ltd. (south Korea) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research coverage are Toshiba Corporation (Japan), ANSYS (United States) and NHanced Semiconductors (United States).
Segmentation Overview
AMA Research has segmented the market of Global 3D Ics market by Type (3D SiCs and Monolithic 3D ICs), Application (Flash Memory, Image Sensor, Micro-Display and Others) and Region.
On the basis of geography, the market of 3D Ics has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Sales Channels, the sub-segment i.e. Online Sales Channels will boost the 3D Ics market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Industry Vertical, the sub-segment i.e. Consumer Electronics will boost the 3D Ics market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Increasing Number of New Market Entrants in This Industry, Rapid Investment in Research & Development and Rise in demand for high-bandwidth memory (HBM) chips
Market Growth Drivers:
Development in Electronics Industry and High Adoption of Consumer Electronics Products
Challenges:
Complexity in Nature
Restraints:
Slowdown in Economy
Opportunities:
Technology Advancement, Increasing Investment by the Electronic Product Manufacturers and Large storage capacity require high bandwidth to manage the memory and bandwidth
Market Leaders and their expansionary development strategies
In October 2021, TSMC and Ansys collaborated to create a comprehensive thermal analysis solution for multi-die designs built with TSMC 3DFabric, TSMC's comprehensive family of 3D silicon stacking and advanced packaging technologies. This solution is built on Ansys tools to simulate the temperature of 3D and 2.5D electronic systems containing multiple chips stacked closely together using the advanced TSMC 3DFabric technologies. Careful thermal analysis prevents these systems from failing due to over-heating and improves their lifetime reliability.
In March 2021, Xilinx, Inc., the leader in adaptive computing, announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
Key Target Audience
Venture Capitalists and Private Equity Firms, New Entrants/Investors, Analyst and Strategic Business Planners, 3D ICs Manufacturers, Suppliers, and Distributors, Raw Material Suppliers, Government Regulatory and Research Organizations and End-Use Industries
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.