About Electronic Packaging
Electronic packaging is defined as the style and production of enclosures for electronic devices starting from individual semiconductors to complete systems like mainframe computers. This protects from mechanical harm, cooling, frequency noise emission, and electrical discharge. economical electronic and semiconductor packaging is employed throughout the manufacture of shopper electronic products like smartphones, TVs, tablets, set-top boxes, digital media adapters to safeguard from electricity discharge, water, harsh atmospheric condition, corrosion, and dust.
Attributes | Details |
---|
Study Period | 2018-2029 |
Base Year | 2023 |
Unit | Value (USD Million) |
The electronic packaging market is expected to remain robust. Advanced packaging technologies, miniaturization trends, and emerging applications will continue to drive market growth. The competitive landscape is likely to evolve further, with potential consolidation, technological disruption, and increased focus on sustainability. Established and emerging Manufacturers should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Blue Spark Technology (United States), AMETEK Inc. (United States), UFP Technologies Inc. (United States), Ayar Labs (United States), SPTS Technologies (United Kingdom), Applied Materials, Inc. (United States), KLA-Tencor Corporation (United States) and XPERI Corporation (United States) are some of the key players that are part of study coverage. Additionally, the Manufacturers which are also part of the research coverage are Smoltek (Sweden), Horexs Electronic Limited (China), Ultrawise Innovation (United Kingdom), VeriSilicon Holdings Co., Ltd. (China) and Amkor Technology, Inc. (United States).
Segmentation Overview
AMA Research has segmented the market of Global Electronic Packaging market by , Application (Consumer Electronics, Aerospace and Defense, Automotive, Healthcare and Others) and Region.
On the basis of geography, the market of Electronic Packaging has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). North America region held largest market share in the year 2023. If we see Market by End Users, the sub-segment i.e. Consumer Electronics will boost the Electronic Packaging market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Technology, the sub-segment i.e. Electronic Article Surveillance (EAS) will boost the Electronic Packaging market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Packaging Type, the sub-segment i.e. Semiconductor will boost the Electronic Packaging market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Material, the sub-segment i.e. Plastic will boost the Electronic Packaging market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Integration of Automation with Manufacturing Machinery for Fast and Efficient Manufacturing
Market Growth Drivers:
The rise in Adoption of Consumer Electronic Devices Such as Smartphones, Tablets, Wearable Devices, Television, And Digital Cameras Containing Innovative Packaging and Growth in Requirement of Robust Electronics Systems in Naval and Marine Applications
Challenges:
Rapid Change in Technology and Demand for the Compact Electronics Packaging Needs and Fluctuating Costs of Raw material
Restraints:
Complex Difficult Maintenance of Defects After Soldered Components Hampers the Market Growth
Opportunities:
Rising Need of High-Quality Military-Grade Packaging in Aerospace and Defence
Market Leaders and their expansionary development strategies
In December 2023, JCET Group partnered with X-Fab to leverage X-Fab's silicon photonics technology for integrated optical components in advanced packages.
In November 2023, JCET Group presented its next-generation fan-out wafer-level packaging (FOWLP) technology, offering low-profile and cost-effective solutions for mobile applications.
Key Target Audience
Electronic Packaging Manufacturer, Hardware Manufacturer, Raw Material Provider, Government Bodies, Research Institutes, End-User Industry and Others
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.