Power Module Packaging Market Scope
Power Module Packaging provides the physical containment for several power components, usually power semiconductor devices. These modules provide high power density and are more reliable compared to discrete power semiconductors. The growing demand for power conversion equipment has increased the demand for power module packaging.
According to AMA, the Global Power Module Packaging market is expected to see growth rate of 10.81%
Research Analyst at AMA estimates that North America and Asia Pacific Players will contribute to the maximum growth of Global Power Module Packaging market throughout the predicted period.
Texas Instruments Incorporated (United States), Star Automations (India), DyDac Controls (India), Semikron (Germany), IXYS Corporation (United States), Infineon Technologies AG (Germany), Mitsubishi Electric Corporation (Japan), ROHM CO., LTD. (Japan), Wolfspeed, Inc. (China), GeneSiC Semiconductor, Inc. (United States), Amkor Technology Inc. (United States), Hitachi Ltd. (Japan), SanRex Corporation (United States), Fuji Electric Co. Ltd. (Japan) and Sanken Electric Co., Ltd. (Japan) are some of the key players that are part of study coverage.
About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a
preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from total available market.
Segmentation Overview
The study have segmented the market of Global Power Module Packaging market , by Application (Motors, Rail Tractions, Wind Turbines, Photovoltaic Equipment and Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)) and Region with country level break-up.
On the basis of geography, the market of Power Module Packaging has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico).
In February 2019, Infineon Technologies launched new product named CoolSiC power modules for UPS and energy storage applications. This modules enable engineers to reduce total system costs by increasing power density and is capability to lower 80% switching losses compared to silicon variants. and For instance, in January 2018, Mitsubishi Electric Corporation launched silicon carbide (SiC) power semiconductor module providing highest power density from 1.7 kV to 6.5 kV.
Market Trend
- Trends Towards Power Module Standardization
Market Drivers
- Increasing Demand for Higher Power Densities and Reliability Improvements
- Demand from the Industrial and Consumer Electronics Industries
Opportunities
- Growing Demand for Power Module Packaging for Space Savings and Reducing Assembly Time
- Growing Use of Power Module Packaging in Producing Energy Efficient Battery Devices
- Growing Demand for Power Module Packaging from Asian Countries
Restraints
- Slow Adoption of Power Module Packaging
Challenges
- Lack of Standard Protocols
Analyst View
Power module packaging is a very dynamic market, where continuous innovations and material enhancements and a lot of R&D investment is needed. The growing semiconductor industry has boosted the demand for power module packaging
Key Target Audience
New Entrants/Investors, Analysts and Strategic Business Planners, Power Module Packaging Manufacturer, Raw Material Suppliers, Venture Capitalists and Private Equity Firms, Government Regulatory and Research Organizations and End-Use Industry