3D Flash Memory Market Scope
3D Flash Memory is developed to overcome 2D NAND’s capacity limitations. It scales to higher densities without sacrificing data integrity. This market has a high demand in enterprises for the replacement of hard disk drives by providing higher storage capacity. The use of TSV technology providing high data rates for low latency. The 3D Flash Memory is moving to the quad-level cell, which is the next step in cell storage density, as a step towards a denser storage system. The technology is a type of flash storage that uses a layered design to increase its maximum chip capacity.
Attributes | Details |
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Study Period | 2018-2028 |
Base Year | 2022 |
Unit | Value (USD Million) |
Key Companies Profiled | Samsung Electronics Co. (South Korea), Toshiba Corporation (Japan), SK Hynix Semiconductor (South Korea), Micron Technology (United States), Intel Corporation (United States), Apple Inc. (United States), Lenovo Group Ltd. (Hong Kong), Advanced Micro Devices (United States), STMicroelectronics (Switzerland) and SanDisk Corporation (United States) |
CAGR | % |
In This Market Players Are Focusing Technology Advancement In Their Offerings Such Involving Artificial Intelligence To Boost Their Productivity Of Products. And Also Working On Layers Developments To Increase The Storage Capacity, Which Helps To Improve Their Market Reach.
Samsung Electronics Co. (South Korea), Toshiba Corporation (Japan), SK Hynix Semiconductor (South Korea), Micron Technology (United States), Intel Corporation (United States), Apple Inc. (United States), Lenovo Group Ltd. (Hong Kong), Advanced Micro Devices (United States), STMicroelectronics (Switzerland) and SanDisk Corporation (United States) are some of the key players that are part of study coverage.
About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from the total available market.
Segmentation Overview
The study have segmented the market of Global 3D Flash Memory market by Type , by Application (Cameras, Laptop & Pcs, Smartphones & Tablets, Others, Hyperconverged Infrastructure (HCI) and High-Capacity Environments) and Region with country level break-up.
On the basis of geography, the market of 3D Flash Memory has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico).
region held largest market share in the year 2022.
Market Leaders and their expansionary development strategies
In March 2023, Kioxia and western digital announce the newest 3D Flash technology. the new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation partnership. kioxia and western digital reduced the cost by introducing several unique processes and architecture, enabling continued lateral scaling advancement
In Jan 2019, Samsung Announced Its New 96-Layer 3D NAND Flash Memory in the Form of the 970 EVO Plus. It Is Updated Version Of Samsung 970 EVO And Having New NAND Chips. It Is Available In Capacities Of 250 GB, 500 GB, TB And 2 TB. Additionally, In 2019 Only Toshiba Announced The Starting Of Construction Of Its New BICs 3D NAND Flash Memory Fab Located In Japan. It Is Defined As New Method Involves Artificial Intelligence To Boost Productivity.
Influencing Trend:
Increase Demand for Smaller Memory Chips, Due Advancement in Electronic Products
Market Growth Drivers:
Increase Demand for Cloud Connected Devices, Increase In Demand for Data Storage across Consumer Electronics and Enterprise Storage Sectors and High Incorporations Internet of Things in Multiple Applications
Challenges:
3D Flash Memory Needs More Silicon and Shortages and Supply Chain Issues
Restraints:
High and Complex Manufacturing Cost Is Become the Barrier for This Market
Opportunities:
High Potential Growth in This Market by Providing Higher Capacity of Storage and Improved Power Efficiency for Increasing Demand in Consumer Electronics
Key Target Audience
Venture Capitalists and Private Equity Firms, New Entrants/Investors, Analysts and Strategic Business Planners, 3D Flash Memory Manufacturers, Suppliers and Distributors, Government Regulatory and Research Organizations and End-Use Industries