Extreme Ultraviolet Lithography Market Scope
Extreme ultraviolet lithography (EUVL) is a next-generation lithography technology that uses small wavelength to generate circuits with small features and obtain better resolution output. It is an advanced microchip manufacturing technology that uses a single mask instead of multiple masks. EUVL is used to print complex patterns of semiconductor wafers defined by the integrated circuit. To create high power EUV radiation, laser-produced plasma (LPP) and discharge-produced plasma (DPP) is the noticeable technology used.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
High Growth Market | Asia- Pacific |
Largest Market | North America |
Unit | Value (USD Million) |
Key Companies Profiled | ASML (Netherlands), Canon Inc. (Japan), Intel Corporation (United States), Nikon Corporation (Japan), NuFlare Technology Inc. (Japan), Samsung Corporation (South Korea), SUSS Microtec AG (Germany), Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan), Ultratech Inc. (United States) and Toshiba (Japan) |
CAGR | 24.6% |
The global extreme ultraviolet lithography (EUVL) is fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market in order to sustain in long run. Leading global players are focusing on strategic partnerships to improve their products and services. In addition, companies are focusing on increasing their client base to strengthen market position and to enhance product & service offerings. Research Analyst at AMA estimates that United States Players will contribute to the maximum growth of Global Extreme Ultraviolet Lithography market throughout the predicted period.
ASML (Netherlands), Canon Inc. (Japan), Intel Corporation (United States), Nikon Corporation (Japan), NuFlare Technology Inc. (Japan), Samsung Corporation (South Korea), SUSS Microtec AG (Germany), Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan), Ultratech Inc. (United States) and Toshiba (Japan) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research are Vistec Semiconductor Systems (Germany), Carl Zeiss AG (Germany) and Toppan Printing (Japan).
About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from the total available market.
Segmentation Overview
The study have segmented the market of Global Extreme Ultraviolet Lithography market by Type , by Application (Memory, IDM (Integrated Device Manufacturer (IDM), Foundry and Others) and Region with country level break-up.
On the basis of geography, the market of Extreme Ultraviolet Lithography has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). North America region held largest market share in the year 2023. Europe on the other hand stood as second largest market due to the presence of key companies into the region and high technological advancement.
Market Leaders and their expansionary development strategies
In October 2023, Canon, a major player in semiconductor equipment, partnered with IMEC, a leading research institute, to explore the use of EUV technology for next-generation memory chips. This collaboration aims to unlock the potential of EUV for creating high-density memory solutions for future electronic devices.
In October 2023, Intel successfully demonstrated the world's first 5-nanometer wafer using high-NA EUV, marking a significant milestone in miniaturization and chip performance.
Influencing Trend:
Increasing Use of Extreme Ultraviolet Lithography in the Semiconductor Industry
Market Growth Drivers:
Reduction in the Complexity and Cost and Increasing Trend of Miniaturization
Challenges:
Risk of Unknown Technical Flaws
Restraints:
Limited Acceptance of Extreme Ultraviolet Lithography
Opportunities:
Advancements in Miniaturization and Sophistication of Electronic and Less Number of Masking Layers Compared To the Argon Fluoride Immersion Technology
Key Target Audience
Research and Development (R&D) Companies, Government Research Laboratories, Independent Research Laboratories, Government and Independent Regulatory Authorities, Market Research and Consulting Service Providers, Academic Institutes and Universities and Others