About Lead-Free Solder Paste
Solder paste is made up of solder alloy powder suspended in a flux vehicle and used in electronic manufacturing as the primary joining medium. Lead-free soldering paste offers high levels of fluxing activity as well as enhances thermal stability. As reflowing under air pollution, this helps to avoid thermal degradation. Lead-free solder pastes resolve various issues such as low area ratio printing, high-reliability requirements for LED, QFN voiding, among others. Some of the features of lead-free solder paste products are long pause-to-print capabilities, reduces voiding, eliminates head-in-pillow defects, among others.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
The market is highly fragmented with the presence of local and regional players operating in the market. Various players operating in the market such as Senju Metal Industry Co. Ltd. (Japan), MG Chemicals (Australia), Tamura Corporation (Japan), MacDermid Alpha Electronics Solutions (United States), among others. Analyst at AMA Research estimates that China and Japan Vendors will contribute the maximum growth to Global Lead-Free Solder Paste market throughout the forecasted period. Established and emerging Vendors should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Senju Metal Industry Co. Ltd. (Japan), MG Chemicals (Australia), Tamura Corporation (Japan), MacDermid Alpha Electronics Solutions (United States), Suochen Metals Co Ltd (China), Tongfang Tech (China), Yashida (China), Chengxing Group (China), Indium Corporation (United States) and Nihon Superior (M) Sdn. Bhd. (Malaysia) are some of the key players that are part of study coverage. Additionally, the Vendors which are also part of the research coverage are Shenzhen Bright (China), Qualitek (India), Interflux Electronics (Belgium), Balver Zinn Josef Jost (Germany) and Uchihashi Estec Co., Ltd. (Japan).
Segmentation Overview
AMA Research has segmented the market of Global Lead-Free Solder Paste market by Type (Low-Temperature Lead-Free Solder Paste , Middle-Temperature Lead-Free Solder Paste and High-Temperature Lead-Free Solder Paste), Application (Wire Board , PCB Board , SMT and Others) and Region.
On the basis of geography, the market of Lead-Free Solder Paste has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Distribution Channel, the sub-segment i.e. Online will boost the Lead-Free Solder Paste market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Technology Advancement regarding Lead-Free Solder Paste
Market Growth Drivers:
Rising Demand from Electronic Manufacturing Services and Increasing usage Lead Free Solder Paste in Various Application
Challenges:
Lack of Awareness regarding Lead-Free Solder Paste
Restraints:
Stringent Rules as well as Regulation
Opportunities:
Growing Demand from Emerging Economics such as China, India, and Others and Increasing Demand Due to Environmental Concerns of Lead
Market Leaders and their expansionary development strategies
In May 2023, Indium Corporation introduced Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance. Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys.
In June 2021, SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Key Target Audience
Lead-Free Solder Paste Manufacturers Company, Regulatory Bodies, Component Suppliers, Government Regulatory Authorities, Technology Investors and Others
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.