What is Structural Electronics Market?
structural electronics (SE), refers as electronics technology which is based on the next generation, it basically involves the printing of functional circuitry of electronic, across the architecture of electronic shaped. Currently it is replacing the bulky load-bearing structures within a circuitry with the components of smart electronic components.
The market study is being classified by Type (Printed and Flexible Electronics, 3D Printers, Origami Zippered Tubes and Others), by Application (Aerospace, Automotive, Electricity and Others (Bridges & Buildings)) and major geographies with country level break-up.
Boeing (United States), Soligie (United States), Canatu (Finland), Faradair Aerospace (United Kingdom), Local Motors (United States), Optomec (United States), Neotech (United States), TactoTek Oy (Finland), Toyobo Co. Ltd (Japan), Panasonic Corporation (Japan) and Molex LLC (United States) are some of the key players profiled in the study.
The structural electronics market is highly consolidated. The reason is that structural electronics is a highly sophisticated technology that makes it very tough for the new players to enter this market. Moreover, the top players have a major share in the market. Research Analyst at AMA predicts that United States Players will contribute to the maximum growth of Global Structural Electronics market throughout the predicted period.
Segment Analysis
Analyst at AMA have segmented the market study of Global Structural Electronics market by Type, Application and Region.
On the basis of geography, the market of Structural Electronics has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Market Drivers
- Emerging Need for Lightweight, Compact, Cost-effective Products
- Higher penetration in the Market for Flexible and Printed Electronics
Market Trend
- Advancement in 3D Technology
Restraints
- Lack of Technological Awareness
Opportunities
- Increased Adoption in High End Products such as Conductors, Sensors, and Photo voltaic
Challenges
- Tough for the New Entrants to Enter into the Market
- Manufacturing process is Complex
Market Leaders and some development strategies
TactoTek, the leader in Injection Molded Structural Electronics (IMSE) solutions announced that it is collaborating with Dassault Systèmes to enable users of the 3DEXPERIENCE platform to digitally experiment with TactoTek IMSE parts.
Boeing and the Australian Space Agency signed a statement of strategic intent to help advance the agency’s goals to expand Australia’s domestic space industry.
Key Target Audience
Venture Capitalists and Private Equity Firms, New Entrants/Investors, Analysts and Strategic Business Planners, Manufacturers, Suppliers, and Distributors, Raw Material Suppliers, Government Regulatory and Research Organizations and End-Use Industries