Scope of the Study
Integrated circuits or ICs are the chips used in nearly all modern electrical devices. Most production devices use chips soldered directly to the printed circuit board i.e. PCB, as the chips never need to be detached. Some applications, conversely, use IC sockets, which allow chips to be inserted and removed without the use of a soldering iron. Programmable chips like EPROMs or microcontrollers are placed in IC sockets during prototyping, allowing the devices to be quickly detached from the circuit for programming, and again reinserted for testing. Some ICs are exceptionally sensitive and may be damaged by the heat from soldering, so are placed in IC sockets for safety and easy replacement if failures occur.
The market study is being classified by Type (Dual In-Line Package (DIP), Ball Grid Array (BGA), Quad Flat Pack (QFP), Small-Outline Package (SOP) and Small Outline Integrated Circuit (SOIC)), by Application (Automotive, Consumer Electronics, Military and Defense, Medical Devices and Industrial) and major geographies with country level break-up.
Intel (United States), Loranger International Corporation (United States), Aries Electronics Inc. (United States), Enplas Corporation (Japan), 3M Company (United States), Johnstech International Corporation (United States), Mill-Max Mfg. Corporation (United States), Molex Inc. (United States), Foxconn Technology Group (Taiwan) and Tyco Electronics Ltd. (Switzerland) are some of the key players profiled in the study. Additionally, the Players which are also part of the research are Win Way Technology Co. Ltd. (Taiwan), Yamaichi Electronics Co. Ltd. (Japan), Sensata Technologies B.V. (United States) and Plastronics Socket Company Inc. (United States).
The companies are focusing on strategic partnerships to improve their products and services. Moreover, companies are focusing on increasing their client base to strengthen market position and to enhance product & service offerings. Research Analyst at AMA predicts that United States Players will contribute to the maximum growth of Global Microcontroller Socket market throughout the predicted period.
Segment Analysis
AdvanceMarketAnalytics has segmented the market of Global Microcontroller Socket market by Type, Application and Region.
On the basis of geography, the market of Microcontroller Socket has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Distribution Channel, the sub-segment i.e. Online will boost the Microcontroller Socket market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Market Drivers
- Growing Microcontroller Applications
- Upsurge in IC Packaging Development
Market Trend
- Rising Adoption of Smart Machines and Application of Embedded System
Restraints
- Extreme Competition in the Industry
Opportunities
- Technological Developments in Microcontroller Socket
Challenges
- Fluctuations in Demand and Cyclical Nature of Industry
Key Target Audience
Manufacturers of Microcontroller Socket, Suppliers of Microcontroller Socket Parts, Wholesalers, Distributors and Retailers of Microcontroller Socket, Semiconductor Industry, Governmental Bodies and Research Firms
Customization in the Report Available:
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Data related to EXIM [Export- Import], production & consumption by country or regional level break-up can be provided based on client request**
** Confirmation on availability of data would be informed prior purchase