About Heatsink
A heatsink is a heat exchanger device that incorporates either a fan or some other means to keep a hot component such as processor cooled down. It prevents the device from overheating. It transfers thermal energy from a higher temperature device to a lower temperature fluid medium. It generally constructed from copper or aluminum. The copper has a very high thermal conductivity and aluminum has lower density and lower cost. It can be manufactured in a variety of ways including machining, extrusion, forging, stamping and skiving. On 26th September 2019, Cooler Master Co., Ltd. has launched MasterAir MA620M heatsink comes with dual blacked-out aluminum towers with a uniform 6 heat pipe layout to dissipate the heat evenly. It provides high air pressure with silent performance to cool away the heat from the heat pipes in silence.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
Competition among existing players is due to the Heatsink market share occupied by leading players. The industry leader is engaged in offering innovative and superior quality products to cater to the ever-growing demand for Heatsink Market. The companies are implementing strategic activities such as acquisitions and mergers along with collaboration with companies in other industries to aid them in improving sustenance and maintaining their competitive advantage. Analyst at AMA Research estimates that United States Manufacturers will contribute the maximum growth to Global Heatsink market throughout the forecasted period. Established and emerging Manufacturers should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Fischer Elektronik GmbH & Co. KG (Germany), Anacon Electronic Sales, Inc. (United States), Autonics Corporation (United States), Cooler Master Co., Ltd. (Taiwan), Noctua (Austria), Thermaltake Technology Co., Ltd (Taiwan), Zalman Tech Co. (South Korea), TE Connectivity Ltd (Switzerland), Molex Incorporated (United States) and Apex Microtechnology (United States) are some of the key players that are part of study coverage.
Segmentation Overview
AMA Research has segmented the market of Global Heatsink market by Type (Active Heatsink and Passive Heatsink), Application (Automobile Industry, Electronic Industry and Others) and Region.
On the basis of geography, the market of Heatsink has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Material, the sub-segment i.e. Aluminum Heatsink will boost the Heatsink market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Improvements in the Heatsink Designs
Market Growth Drivers:
Thermally Efficient and Durability of Heatsinks and Reduced Weight of the Aluminum Heatsink Creates Demand for Numerous Applications
Challenges:
Slowdown of the World Economy
Restraints:
Extrusion Ratio of the Metals
Opportunities:
Growth of Electronic Industry and Increasing Demand from Automobile Industry
Market Leaders and their expansionary development strategies
In April 2019, TE Connectivity (TE), a world leader in connectivity and sensors, has signed a definitive agreement to acquire the Kissling group of companies.
In May 2022, Avnet’s launched heatsink for the AMD-Xilinx Kria K26 adaptive system on modules (SOMs) is the only off-the-shelf solution specifically designed for these SOMs and it is available now. Avnet’s heatsink mounts directly to the heat spreader plate that comes standard on the K26 SOM. This solution is “turnkey” as it includes the mounting hardware as well as the interface “gap” material preinstalled on the heat sink.
Key Target Audience
Heatsink Manufacturers, Research Professionals, Emerging Companies, Raw Material Suppliers/ Buyers, Distributors, Government Body & Associations and End-user
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.