About Laser Pcb Drilling
Laser PCB (printed circuit board) drilling uses a focused laser beam to create precise holes like microvias in PCBs to connect different layers. This is especially useful for blind structures that require precise depth control, which lasers can achieve. The process involves shaping and directing the laser beam with high precision optics. When the beam hits the board, the material absorbs the energy and heats up rapidly which breaks chemical bonds and melts the spot. The molten material then vaporizes and creates a hole. The control of the beam’s energy, size and exposure determines the hole’s diameter and depth. Laser drilling is preferred for its accuracy and ability to create micro holes so it’s a must for making sleek devices. Advantages of laser drilling is it’s a non-contact process and vibration is eliminated. Also, the intensity, heat output and duration of the laser beam can be controlled to create different hole shapes with high accuracy. There are several techniques of laser drilling namely single pulse, percussion, trepanning and helical drilling. Single pulse uses one high energy pulse to create larger holes while percussion uses multiple laser pulses to create deeper holes with higher precision.
Attributes | Details |
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Study Period | 2020-2032 |
Base Year | 2024 |
Unit | Value (USD Million) |
Established and emerging Manufacturers should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Showa Optron Co. (Japan), Coherent (Santa Clara, California, United States), Han's Laser Technology Industry Group (China), LPKF Laser Electronics (Garbsen, Germany), RofinSinar Technologies (United States), Modus Advanced (United Kingdom), IPG Photonics (United States), Optotek (Zadar, Croatia), Jenoptik AG (Germany), Multiwave Technologies (United States), InnoLas Laser GmbH (Germany), Fianium (United Kingdom), Trumpf Laser (Germany) and Hitachi High-Technologies (Japan) are some of the key players that are part of study coverage.
Segmentation Overview
AMA Research has segmented the market of Global Laser Pcb Drilling market by , Application (Automotive Electronics, Consumer Electronics, Industrial Automation, Medical Devices and Defense and Aerospace) and Region.
On the basis of geography, the market of Laser Pcb Drilling has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Laser Type, the sub-segment i.e. Excimer Laser will boost the Laser Pcb Drilling market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Hole Size, the sub-segment i.e. 100 microns will boost the Laser Pcb Drilling market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Material, the sub-segment i.e. FR-4 will boost the Laser Pcb Drilling market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.