Global SiC Wafer Polishing Market Overview:
Silicon carbide (SiC) wafer polishing is a crucial step in the manufacturing process of SiC wafers, which are used in various applications such as power electronics, automotive, telecommunications, and aerospace. The polishing process removes surface defects and impurities from the wafer, resulting in a smooth, defect-free surface that is essential for properly functioning the electronic devices fabricated on the wafer. The potential benefits of SiC wafers are significant, and the market is expected to grow rapidly in the coming years. The increasing demand for SiC-based power devices, the development of new polishing technologies, and the increasing availability of SiC wafers are all expected to contribute to this growth.
As per latest study released by AMA Research, the Global SiC Wafer Polishing market is expected to see growth rate of 7.0%Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Forecast Period | 2024-2030 |
Historical Period | 2018-2023 |
Unit | Value (USD Million) |
Customization Scope | Avail customization with purchase of this report. Add or modify country, region & or narrow down segments in the final scope subject to feasibility |
Influencing Trend:
The Increasing use of Chemical-Mechanical Polishing
Market Growth Drivers:
Growing Adoption of SiC Wafers in Power Electronics and Increasing Demand for Electric Vehicles
Challenges:
High Initial Investment
Restraints:
Long Polishing Cycle times
Opportunities:
Government Support for the Development of SiC Technology and Development of New Polishing Materials and Technologies
Competitive Landscape:
The market is seeing moderate market players, by seeing huge growth in this market the key leading vendors are highly focusing on production technologies, efficiency enhancement, and product life. This market has various growth opportunities that leading players capture via tracking the ongoing process enhancement and huge investment in market growth strategies.
Some of the key players profiled in the report are 3M (United States), Advanced Abrasives Corporation (United States), AGC Inc. (Japan), Engis Corporation (United States), SOITEC (France), Entegris (United States), Vibrantz (United States), Fujimi Incorporated (Japan), Revasum (United States) and ILJIN DIAMOND CO., LTD. (South Korea). Additionally, following companies can also be profiled that are part of our coverage like Lapmaster Wolters (United States), Logitech (Switzerland), Shanghai Xinanna Electronic Technology Co., LTD. (China), SKC, Inc. (South Korea), JSR Corporation (Japan) and Kemet International Limited (United Kingdom). Analyst at AMA Research see United States Manufacturers to retain maximum share of Global SiC Wafer Polishing market by 2030. Considering Market by Process, the sub-segment i.e. Chemical Polishing will boost the SiC Wafer Polishing market.
Latest Market Insights:
In December 2021, Soitec, a French company that designs and manufactures semiconductor materials, acquired NOVASiC, a French company specializing in polishing and reclaiming silicon carbide (SiC) wafers. This acquisition aimed to solidify Soitec's position in the SiC wafer technology market, particularly for applications in the automotive and industrial sectors.
In July 2023, Revasum announced the release of a 200mm conversion kit for their 6EZ SiC CMP platform. The 200mm conversion kit enables the 6EZ platform to process SiC wafers up to 200mm in diameter, compared to the previous limit of 150mm. This larger format allows for more die per wafer, potentially reducing production costs and increasing overall output.
What Can be Explored with the SiC Wafer Polishing Market Study
Gain Market Understanding
Identify Growth Opportunities
Analyze and Measure the Global SiC Wafer Polishing Market by Identifying Investment across various Industry Verticals
Understand the Trends that will drive Future Changes in SiC Wafer Polishing
Understand the Competitive Scenario
- Track Right Markets
- Identify the Right Verticals
Research Methodology:
The top-down and bottom-up approaches are used to estimate and validate the size of the Global SiC Wafer Polishing market.
In order to reach an exhaustive list of functional and relevant players various industry classification standards are closely followed such as NAICS, ICB, SIC to penetrate deep in important geographies by players and a thorough validation test is conducted to reach most relevant players for survey in SiC Wafer Polishing market.
In order to make priority list sorting is done based on revenue generated based on latest reporting with the help of paid databases such as Factiva, Bloomberg etc.
Finally the questionnaire is set and specifically designed to address all the necessities for primary data collection after getting prior appointment by targeting key target audience that includes Government Bodies, Potential Investors, New Entrants, Research Center and Others.
This helps us to gather the data related to players revenue, operating cycle and expense, profit along with product or service growth etc.
Almost 70-80% of data is collected through primary medium and further validation is done through various secondary sources that includes Regulators, World Bank, Association, Company Website, SEC filings, OTC BB, USPTO, EPO, Annual reports, press releases etc.