Global Ball Grid Array (BGA) Packaging Market

Ball Grid Array (BGA) Packaging Comprehensive Study by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA), End Use (IT & Telecommunication, Consumer Electronics, Aerospace & Defense, Industrial, Automotive, Healthcare, Others), Material (Ceramic, Plastic, Tape, Others) Players and Region - Global Market Outlook to 2028

Ball Grid Array (BGA) Packaging Market by XX Submarkets | Forecast Years 2023-2028  

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  • Summary
  • Market Segments
  • Table of Content
  • List of Table & Figures
  • Players Profiled
Ball Grid Array (BGA) Packaging Market Scope
The ball grid array (BGA) has become one of the industry's most preferred packaging options for high I/O devices. It has a number of advantages over other high-leadcount packages (more than 208 leads). The BGA has considerably decreased coplanarity concerns and minimized handling issues due to the lack of leads to bend. Solder balls self-center (up to 50% off the pad) during reflow, which reduces surface mount placement issues. In comparison to a dual in-line or flat package, BGA can provide more connector pins. The traces connecting the package's leads to the wires or balls that connect the die to the package are also on average shorter than in a perimeter-only type, resulting in improved high-speed performance.

AttributesDetails
Study Period2018-2028
Base Year2022
UnitValue (USD Million)
Key Companies ProfiledIntel Corporation (United States), TriQuint Semiconductor Inc. (United States), Jiangsu Changjiang Electronics Technology (China), Corintech Ltd. (United Kingdom), STATS ChipPAC (Singapore), ASE Technology Holding (Taiwan), Integrated Circuit Engineering Corp. (India), Cypress Semiconductor Corp. (United States), Infineon Technologies AG (Germany) and NXP Semiconductors NV. (Netherlands)
CAGR%


The global market is highly competitive and consists of a limited number of providers who compete with each other. The intense competition, changing consumer spending patterns, demographic trends, and frequent changes in consumer preferences pose significant opportunities for market growth. Research Analyst at AMA estimates that United States Manufacturers will contribute to the maximum growth of Global Ball Grid Array (BGA) Packaging market throughout the predicted period.

Intel Corporation (United States), TriQuint Semiconductor Inc. (United States), Jiangsu Changjiang Electronics Technology (China), Corintech Ltd. (United Kingdom), STATS ChipPAC (Singapore), ASE Technology Holding (Taiwan), Integrated Circuit Engineering Corp. (India), Cypress Semiconductor Corp. (United States), Infineon Technologies AG (Germany) and NXP Semiconductors NV. (Netherlands) are some of the key players that are part of study coverage. Additionally, the Manufacturers which are also part of the research are Amkor Technology (United States), NexLogic Technologies (United States), Advanced Interconnections Corp (United States), Palomar Technologies (United States) and Micro Systems Engineering GmbH (Germany).

About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from the total available market.

Segmentation Overview
The study have segmented the market of Global Ball Grid Array (BGA) Packaging market by Type and Region with country level break-up.

On the basis of geography, the market of Ball Grid Array (BGA) Packaging has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). region held largest market share in the year 2022.

On 13th September, 2020 - STMicroelectronics Launched Package-on-Package Memory System Solutions for Mobile Applications. The PoP Structure Allows Two BGA (Ball Grid Array) Packages to Be Layered on Top Of Each Other: The Bottom Pop Package Includes an Array of Metallic Balls, Or Bumps, On the Underside of The Package. and On 28th April, 2021 - ATP Introduced “PCIe Gen3 x4 NVMe” SSDs in M.2 Type 1620 Heatsink Ball-Grid Array (HSBGA) Package. BGA SSD Technology Enables the Integration of NAND Flash and Controller into A Single Device That Is Lightweight While Providing High Performance and Large Capacity.


Influencing Trend:
Emergence of Advance Package on Package (PoP) BGA Systems

Market Growth Drivers:
Rising Implementation of Plastic Ball Grid Arrays in Packaging and High R&D Investments

Challenges:
Fierce Competitive Pressure and High Initial Investments

Restraints:
Lack of Trained Professionals and Raw Material Price Fluctuation

Opportunities:
Increasing Industrial Infrastructure Across Emerging Regions

Key Target Audience
Ball Grid Array Manufactures, New Entrants and Investors, Venture Capitalists, Government Bodies, Corporate Entities, Government and Private Research Organizations and Others

Report Objectives / Segmentation Covered

By Type
  • Molded Array Process BGA
  • Thermally Enhanced BGA
  • Package on Package (PoP) BGA
  • Micro BGA
By End Use
  • IT & Telecommunication
  • Consumer Electronics
  • Aerospace & Defense
  • Industrial
  • Automotive
  • Healthcare
  • Others

By Material
  • Ceramic
  • Plastic
  • Tape
  • Others

By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Rising Implementation of Plastic Ball Grid Arrays in Packaging
      • 3.2.2. High R&D Investments
    • 3.3. Market Challenges
      • 3.3.1. Fierce Competitive Pressure
      • 3.3.2. High Initial Investments
    • 3.4. Market Trends
      • 3.4.1. Emergence of Advance Package on Package (PoP) BGA Systems
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Ball Grid Array (BGA) Packaging, by Type, End Use, Material and Region (value) (2017-2022)
    • 5.1. Introduction
    • 5.2. Global Ball Grid Array (BGA) Packaging (Value)
      • 5.2.1. Global Ball Grid Array (BGA) Packaging by: Type (Value)
        • 5.2.1.1. Molded Array Process BGA
        • 5.2.1.2. Thermally Enhanced BGA
        • 5.2.1.3. Package on Package (PoP) BGA
        • 5.2.1.4. Micro BGA
      • 5.2.2. Global Ball Grid Array (BGA) Packaging by: End Use (Value)
        • 5.2.2.1. IT & Telecommunication
        • 5.2.2.2. Consumer Electronics
        • 5.2.2.3. Aerospace & Defense
        • 5.2.2.4. Industrial
        • 5.2.2.5. Automotive
        • 5.2.2.6. Healthcare
        • 5.2.2.7. Others
      • 5.2.3. Global Ball Grid Array (BGA) Packaging by: Material (Value)
        • 5.2.3.1. Ceramic
        • 5.2.3.2. Plastic
        • 5.2.3.3. Tape
        • 5.2.3.4. Others
      • 5.2.4. Global Ball Grid Array (BGA) Packaging Region
        • 5.2.4.1. South America
          • 5.2.4.1.1. Brazil
          • 5.2.4.1.2. Argentina
          • 5.2.4.1.3. Rest of South America
        • 5.2.4.2. Asia Pacific
          • 5.2.4.2.1. China
          • 5.2.4.2.2. Japan
          • 5.2.4.2.3. India
          • 5.2.4.2.4. South Korea
          • 5.2.4.2.5. Taiwan
          • 5.2.4.2.6. Australia
          • 5.2.4.2.7. Rest of Asia-Pacific
        • 5.2.4.3. Europe
          • 5.2.4.3.1. Germany
          • 5.2.4.3.2. France
          • 5.2.4.3.3. Italy
          • 5.2.4.3.4. United Kingdom
          • 5.2.4.3.5. Netherlands
          • 5.2.4.3.6. Rest of Europe
        • 5.2.4.4. MEA
          • 5.2.4.4.1. Middle East
          • 5.2.4.4.2. Africa
        • 5.2.4.5. North America
          • 5.2.4.5.1. United States
          • 5.2.4.5.2. Canada
          • 5.2.4.5.3. Mexico
  • 6. Ball Grid Array (BGA) Packaging: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2022)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. Intel Corporation (United States)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. TriQuint Semiconductor Inc. (United States)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Jiangsu Changjiang Electronics Technology (China)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. Corintech Ltd. (United Kingdom)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. STATS ChipPAC (Singapore)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. ASE Technology Holding (Taiwan)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. Integrated Circuit Engineering Corp. (India)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. Cypress Semiconductor Corp. (United States)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
      • 6.4.9. Infineon Technologies AG (Germany)
        • 6.4.9.1. Business Overview
        • 6.4.9.2. Products/Services Offerings
        • 6.4.9.3. Financial Analysis
        • 6.4.9.4. SWOT Analysis
      • 6.4.10. NXP Semiconductors NV. (Netherlands)
        • 6.4.10.1. Business Overview
        • 6.4.10.2. Products/Services Offerings
        • 6.4.10.3. Financial Analysis
        • 6.4.10.4. SWOT Analysis
  • 7. Global Ball Grid Array (BGA) Packaging Sale, by Type, End Use, Material and Region (value) (2023-2028)
    • 7.1. Introduction
    • 7.2. Global Ball Grid Array (BGA) Packaging (Value)
      • 7.2.1. Global Ball Grid Array (BGA) Packaging by: Type (Value)
        • 7.2.1.1. Molded Array Process BGA
        • 7.2.1.2. Thermally Enhanced BGA
        • 7.2.1.3. Package on Package (PoP) BGA
        • 7.2.1.4. Micro BGA
      • 7.2.2. Global Ball Grid Array (BGA) Packaging by: End Use (Value)
        • 7.2.2.1. IT & Telecommunication
        • 7.2.2.2. Consumer Electronics
        • 7.2.2.3. Aerospace & Defense
        • 7.2.2.4. Industrial
        • 7.2.2.5. Automotive
        • 7.2.2.6. Healthcare
        • 7.2.2.7. Others
      • 7.2.3. Global Ball Grid Array (BGA) Packaging by: Material (Value)
        • 7.2.3.1. Ceramic
        • 7.2.3.2. Plastic
        • 7.2.3.3. Tape
        • 7.2.3.4. Others
      • 7.2.4. Global Ball Grid Array (BGA) Packaging Region
        • 7.2.4.1. South America
          • 7.2.4.1.1. Brazil
          • 7.2.4.1.2. Argentina
          • 7.2.4.1.3. Rest of South America
        • 7.2.4.2. Asia Pacific
          • 7.2.4.2.1. China
          • 7.2.4.2.2. Japan
          • 7.2.4.2.3. India
          • 7.2.4.2.4. South Korea
          • 7.2.4.2.5. Taiwan
          • 7.2.4.2.6. Australia
          • 7.2.4.2.7. Rest of Asia-Pacific
        • 7.2.4.3. Europe
          • 7.2.4.3.1. Germany
          • 7.2.4.3.2. France
          • 7.2.4.3.3. Italy
          • 7.2.4.3.4. United Kingdom
          • 7.2.4.3.5. Netherlands
          • 7.2.4.3.6. Rest of Europe
        • 7.2.4.4. MEA
          • 7.2.4.4.1. Middle East
          • 7.2.4.4.2. Africa
        • 7.2.4.5. North America
          • 7.2.4.5.1. United States
          • 7.2.4.5.2. Canada
          • 7.2.4.5.3. Mexico
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Ball Grid Array (BGA) Packaging: by Type(USD Million)
  • Table 2. Ball Grid Array (BGA) Packaging Molded Array Process BGA , by Region USD Million (2017-2022)
  • Table 3. Ball Grid Array (BGA) Packaging Thermally Enhanced BGA , by Region USD Million (2017-2022)
  • Table 4. Ball Grid Array (BGA) Packaging Package on Package (PoP) BGA , by Region USD Million (2017-2022)
  • Table 5. Ball Grid Array (BGA) Packaging Micro BGA , by Region USD Million (2017-2022)
  • Table 6. Ball Grid Array (BGA) Packaging: by End Use(USD Million)
  • Table 7. Ball Grid Array (BGA) Packaging IT & Telecommunication , by Region USD Million (2017-2022)
  • Table 8. Ball Grid Array (BGA) Packaging Consumer Electronics , by Region USD Million (2017-2022)
  • Table 9. Ball Grid Array (BGA) Packaging Aerospace & Defense , by Region USD Million (2017-2022)
  • Table 10. Ball Grid Array (BGA) Packaging Industrial , by Region USD Million (2017-2022)
  • Table 11. Ball Grid Array (BGA) Packaging Automotive , by Region USD Million (2017-2022)
  • Table 12. Ball Grid Array (BGA) Packaging Healthcare , by Region USD Million (2017-2022)
  • Table 13. Ball Grid Array (BGA) Packaging Others , by Region USD Million (2017-2022)
  • Table 14. Ball Grid Array (BGA) Packaging: by Material(USD Million)
  • Table 15. Ball Grid Array (BGA) Packaging Ceramic , by Region USD Million (2017-2022)
  • Table 16. Ball Grid Array (BGA) Packaging Plastic , by Region USD Million (2017-2022)
  • Table 17. Ball Grid Array (BGA) Packaging Tape , by Region USD Million (2017-2022)
  • Table 18. Ball Grid Array (BGA) Packaging Others , by Region USD Million (2017-2022)
  • Table 19. South America Ball Grid Array (BGA) Packaging, by Country USD Million (2017-2022)
  • Table 20. South America Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 21. South America Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 22. South America Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 23. Brazil Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 24. Brazil Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 25. Brazil Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 26. Argentina Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 27. Argentina Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 28. Argentina Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 29. Rest of South America Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 30. Rest of South America Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 31. Rest of South America Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 32. Asia Pacific Ball Grid Array (BGA) Packaging, by Country USD Million (2017-2022)
  • Table 33. Asia Pacific Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 34. Asia Pacific Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 35. Asia Pacific Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 36. China Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 37. China Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 38. China Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 39. Japan Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 40. Japan Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 41. Japan Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 42. India Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 43. India Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 44. India Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 45. South Korea Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 46. South Korea Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 47. South Korea Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 48. Taiwan Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 49. Taiwan Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 50. Taiwan Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 51. Australia Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 52. Australia Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 53. Australia Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 54. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 55. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 56. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 57. Europe Ball Grid Array (BGA) Packaging, by Country USD Million (2017-2022)
  • Table 58. Europe Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 59. Europe Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 60. Europe Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 61. Germany Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 62. Germany Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 63. Germany Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 64. France Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 65. France Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 66. France Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 67. Italy Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 68. Italy Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 69. Italy Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 70. United Kingdom Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 71. United Kingdom Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 72. United Kingdom Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 73. Netherlands Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 74. Netherlands Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 75. Netherlands Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 76. Rest of Europe Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 77. Rest of Europe Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 78. Rest of Europe Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 79. MEA Ball Grid Array (BGA) Packaging, by Country USD Million (2017-2022)
  • Table 80. MEA Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 81. MEA Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 82. MEA Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 83. Middle East Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 84. Middle East Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 85. Middle East Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 86. Africa Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 87. Africa Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 88. Africa Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 89. North America Ball Grid Array (BGA) Packaging, by Country USD Million (2017-2022)
  • Table 90. North America Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 91. North America Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 92. North America Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 93. United States Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 94. United States Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 95. United States Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 96. Canada Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 97. Canada Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 98. Canada Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 99. Mexico Ball Grid Array (BGA) Packaging, by Type USD Million (2017-2022)
  • Table 100. Mexico Ball Grid Array (BGA) Packaging, by End Use USD Million (2017-2022)
  • Table 101. Mexico Ball Grid Array (BGA) Packaging, by Material USD Million (2017-2022)
  • Table 102. Company Basic Information, Sales Area and Its Competitors
  • Table 103. Company Basic Information, Sales Area and Its Competitors
  • Table 104. Company Basic Information, Sales Area and Its Competitors
  • Table 105. Company Basic Information, Sales Area and Its Competitors
  • Table 106. Company Basic Information, Sales Area and Its Competitors
  • Table 107. Company Basic Information, Sales Area and Its Competitors
  • Table 108. Company Basic Information, Sales Area and Its Competitors
  • Table 109. Company Basic Information, Sales Area and Its Competitors
  • Table 110. Company Basic Information, Sales Area and Its Competitors
  • Table 111. Company Basic Information, Sales Area and Its Competitors
  • Table 112. Ball Grid Array (BGA) Packaging: by Type(USD Million)
  • Table 113. Ball Grid Array (BGA) Packaging Molded Array Process BGA , by Region USD Million (2023-2028)
  • Table 114. Ball Grid Array (BGA) Packaging Thermally Enhanced BGA , by Region USD Million (2023-2028)
  • Table 115. Ball Grid Array (BGA) Packaging Package on Package (PoP) BGA , by Region USD Million (2023-2028)
  • Table 116. Ball Grid Array (BGA) Packaging Micro BGA , by Region USD Million (2023-2028)
  • Table 117. Ball Grid Array (BGA) Packaging: by End Use(USD Million)
  • Table 118. Ball Grid Array (BGA) Packaging IT & Telecommunication , by Region USD Million (2023-2028)
  • Table 119. Ball Grid Array (BGA) Packaging Consumer Electronics , by Region USD Million (2023-2028)
  • Table 120. Ball Grid Array (BGA) Packaging Aerospace & Defense , by Region USD Million (2023-2028)
  • Table 121. Ball Grid Array (BGA) Packaging Industrial , by Region USD Million (2023-2028)
  • Table 122. Ball Grid Array (BGA) Packaging Automotive , by Region USD Million (2023-2028)
  • Table 123. Ball Grid Array (BGA) Packaging Healthcare , by Region USD Million (2023-2028)
  • Table 124. Ball Grid Array (BGA) Packaging Others , by Region USD Million (2023-2028)
  • Table 125. Ball Grid Array (BGA) Packaging: by Material(USD Million)
  • Table 126. Ball Grid Array (BGA) Packaging Ceramic , by Region USD Million (2023-2028)
  • Table 127. Ball Grid Array (BGA) Packaging Plastic , by Region USD Million (2023-2028)
  • Table 128. Ball Grid Array (BGA) Packaging Tape , by Region USD Million (2023-2028)
  • Table 129. Ball Grid Array (BGA) Packaging Others , by Region USD Million (2023-2028)
  • Table 130. South America Ball Grid Array (BGA) Packaging, by Country USD Million (2023-2028)
  • Table 131. South America Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 132. South America Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 133. South America Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 134. Brazil Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 135. Brazil Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 136. Brazil Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 137. Argentina Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 138. Argentina Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 139. Argentina Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 140. Rest of South America Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 141. Rest of South America Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 142. Rest of South America Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 143. Asia Pacific Ball Grid Array (BGA) Packaging, by Country USD Million (2023-2028)
  • Table 144. Asia Pacific Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 145. Asia Pacific Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 146. Asia Pacific Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 147. China Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 148. China Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 149. China Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 150. Japan Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 151. Japan Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 152. Japan Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 153. India Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 154. India Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 155. India Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 156. South Korea Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 157. South Korea Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 158. South Korea Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 159. Taiwan Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 160. Taiwan Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 161. Taiwan Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 162. Australia Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 163. Australia Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 164. Australia Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 165. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 166. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 167. Rest of Asia-Pacific Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 168. Europe Ball Grid Array (BGA) Packaging, by Country USD Million (2023-2028)
  • Table 169. Europe Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 170. Europe Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 171. Europe Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 172. Germany Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 173. Germany Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 174. Germany Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 175. France Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 176. France Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 177. France Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 178. Italy Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 179. Italy Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 180. Italy Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 181. United Kingdom Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 182. United Kingdom Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 183. United Kingdom Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 184. Netherlands Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 185. Netherlands Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 186. Netherlands Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 187. Rest of Europe Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 188. Rest of Europe Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 189. Rest of Europe Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 190. MEA Ball Grid Array (BGA) Packaging, by Country USD Million (2023-2028)
  • Table 191. MEA Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 192. MEA Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 193. MEA Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 194. Middle East Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 195. Middle East Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 196. Middle East Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 197. Africa Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 198. Africa Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 199. Africa Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 200. North America Ball Grid Array (BGA) Packaging, by Country USD Million (2023-2028)
  • Table 201. North America Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 202. North America Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 203. North America Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 204. United States Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 205. United States Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 206. United States Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 207. Canada Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 208. Canada Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 209. Canada Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 210. Mexico Ball Grid Array (BGA) Packaging, by Type USD Million (2023-2028)
  • Table 211. Mexico Ball Grid Array (BGA) Packaging, by End Use USD Million (2023-2028)
  • Table 212. Mexico Ball Grid Array (BGA) Packaging, by Material USD Million (2023-2028)
  • Table 213. Research Programs/Design for This Report
  • Table 214. Key Data Information from Secondary Sources
  • Table 215. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Ball Grid Array (BGA) Packaging: by Type USD Million (2017-2022)
  • Figure 5. Global Ball Grid Array (BGA) Packaging: by End Use USD Million (2017-2022)
  • Figure 6. Global Ball Grid Array (BGA) Packaging: by Material USD Million (2017-2022)
  • Figure 7. South America Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 8. Asia Pacific Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 9. Europe Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 10. MEA Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 11. North America Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 12. Global Ball Grid Array (BGA) Packaging share by Players 2022 (%)
  • Figure 13. Global Ball Grid Array (BGA) Packaging share by Players (Top 3) 2022(%)
  • Figure 14. Global Ball Grid Array (BGA) Packaging share by Players (Top 5) 2022(%)
  • Figure 15. BCG Matrix for key Companies
  • Figure 16. Intel Corporation (United States) Revenue, Net Income and Gross profit
  • Figure 17. Intel Corporation (United States) Revenue: by Geography 2022
  • Figure 18. TriQuint Semiconductor Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 19. TriQuint Semiconductor Inc. (United States) Revenue: by Geography 2022
  • Figure 20. Jiangsu Changjiang Electronics Technology (China) Revenue, Net Income and Gross profit
  • Figure 21. Jiangsu Changjiang Electronics Technology (China) Revenue: by Geography 2022
  • Figure 22. Corintech Ltd. (United Kingdom) Revenue, Net Income and Gross profit
  • Figure 23. Corintech Ltd. (United Kingdom) Revenue: by Geography 2022
  • Figure 24. STATS ChipPAC (Singapore) Revenue, Net Income and Gross profit
  • Figure 25. STATS ChipPAC (Singapore) Revenue: by Geography 2022
  • Figure 26. ASE Technology Holding (Taiwan) Revenue, Net Income and Gross profit
  • Figure 27. ASE Technology Holding (Taiwan) Revenue: by Geography 2022
  • Figure 28. Integrated Circuit Engineering Corp. (India) Revenue, Net Income and Gross profit
  • Figure 29. Integrated Circuit Engineering Corp. (India) Revenue: by Geography 2022
  • Figure 30. Cypress Semiconductor Corp. (United States) Revenue, Net Income and Gross profit
  • Figure 31. Cypress Semiconductor Corp. (United States) Revenue: by Geography 2022
  • Figure 32. Infineon Technologies AG (Germany) Revenue, Net Income and Gross profit
  • Figure 33. Infineon Technologies AG (Germany) Revenue: by Geography 2022
  • Figure 34. NXP Semiconductors NV. (Netherlands) Revenue, Net Income and Gross profit
  • Figure 35. NXP Semiconductors NV. (Netherlands) Revenue: by Geography 2022
  • Figure 36. Global Ball Grid Array (BGA) Packaging: by Type USD Million (2023-2028)
  • Figure 37. Global Ball Grid Array (BGA) Packaging: by End Use USD Million (2023-2028)
  • Figure 38. Global Ball Grid Array (BGA) Packaging: by Material USD Million (2023-2028)
  • Figure 39. South America Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 40. Asia Pacific Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 41. Europe Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 42. MEA Ball Grid Array (BGA) Packaging Share (%), by Country
  • Figure 43. North America Ball Grid Array (BGA) Packaging Share (%), by Country
List of companies from research coverage that are profiled in the study
  • Intel Corporation (United States)
  • TriQuint Semiconductor Inc. (United States)
  • Jiangsu Changjiang Electronics Technology (China)
  • Corintech Ltd. (United Kingdom)
  • STATS ChipPAC (Singapore)
  • ASE Technology Holding (Taiwan)
  • Integrated Circuit Engineering Corp. (India)
  • Cypress Semiconductor Corp. (United States)
  • Infineon Technologies AG (Germany)
  • NXP Semiconductors NV. (Netherlands)
Additional players considered in the study are as follows:
Amkor Technology (United States) , NexLogic Technologies (United States) , Advanced Interconnections Corp (United States) , Palomar Technologies (United States) , Micro Systems Engineering GmbH (Germany)
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Jun 2023 206 Pages 87 Tables Base Year: 2022 Coverage: 15+ Companies; 18 Countries

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Global Ball Grid Array (BGA) Packaging Market Quantitative research analysis
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Frequently Asked Questions (FAQ):

The key segments that are playing vital role in Ball Grid Array (BGA) Packaging Market are by type [Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA and Micro BGA], by end use application [].
The Ball Grid Array (BGA) Packaging Market is gaining popularity and expected to see strong valuation by 2028.
  • Rising Implementation of Plastic Ball Grid Arrays in Packaging
  • High R&D Investments

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