About High-speed Interconnects
A high-speed interconnect addresses data, storage, and high-performance computing connectivity by combining the transceiver, the connector, and the cabling media as one assembly. Because high-speed interconnects incorporate both active electrical and optical components, there is coding embedded in each connector of an assembly. There are two initial coding choices when specifying an assembly, proprietary coding or MSA compliant.
Attributes | Details |
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Study Period | 2018-2030 |
Base Year | 2023 |
Unit | Value (USD Million) |
The companies are exploring the market by adopting mergers & acquisitions, expansions, investments, new service launches and collaborations as their preferred strategies. The players are exploring new geographies through expansions and acquisitions to avail a competitive advantage through combined synergies. Established and emerging Players should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Rockford Components Ltd. (United Kingdom), High Speed Interconnects (United States), NVIDIA Corporation (United States), Huawei Technologies (China), Intel (United States), Broadcom (United States), Siemon (United States), Molex, LLC (United States), II-VI Incorporated (United States) and Leoni AG (Germany) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research coverage are Samtec (United States), Sumitomo Electric Industries, Ltd. (Japan), Shenzhen Gigalight Technology Co., Ltd. (China), Nexans S.A (France), Juniper Networks (United States) and Amphenol (United States).
Segmentation Overview
AMA Research has segmented the market of Global High-speed Interconnects market by Type (Passive Direct Attach Copper Cables (DAC), Active Direct Attach Copper Cables (DAC), Active Copper Cable (ACC), Active Optical Cables (AOC) and Others), Application (Data Centers, Automobile, Telecom, Consumer Electronics, Networking and Computing and Others) and Region.
On the basis of geography, the market of High-speed Interconnects has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Platform, the sub-segment i.e. Ethernet will boost the High-speed Interconnects market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Channel, the sub-segment i.e. Single Channel will boost the High-speed Interconnects market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Range, the sub-segment i.e. Less than equal to 100 m will boost the High-speed Interconnects market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Influencing Trend:
Most Modern Data Centers Have Zeroed in on the SFP And QSFP Form-Factors For Use With DAC And AOC Cabling and Optical Transceivers
Market Growth Drivers:
Growing Demand for High-speed Interconnects Due to Longer Reach and Higher Bandwidth and Increasing Development of Cloud Computing, and Data Centers
Challenges:
Unrecognized Signal Issue in Some High-speed Cable
Restraints:
High Initial Installation and Set-up Cost
Opportunities:
Next-gen Connected Vehicles Driving the Need For High-Speed Interconnect and Cabling Solutions and Cloud-Based Service Providers Are Looking For More Data Efficiency Solution
Market Leaders and their expansionary development strategies
In July 7, 2022, Arcline Investment Management the acquired of Custom Interconnects LLC and the formation of Qnnect LLC, a specialty interconnects platform aimed at solving critical connectivity challenges in high-performance applications. Qnnect brings Custom Interconnects together with Meritec and Joy Signal Technology.
In January 2024, Junkosha, the leading manufacturer of high-performance cable solutions, has chosen DesignCon 2024, America’s largest chip, board and systems event, as the platform to showcase its breakthrough ultra-phase stable advancements in high frequency cabling solutions. The spotlight will be on the launched of the MWX004, which has been developed to cater to the demands of a 6G future in a bid to go beyond the limitations of the 145 GHz barrier. The company will also be unveiling a wider line-up of its latest flexible cables including the MWX001 and MWX002 millimeter wave solutions.
Key Target Audience
High-speed Interconnects Manufacturers, Raw Material Suppliers, Traders/Exporters/Importers, Research Institutes, End-Use Industry and Others
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have a better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with the purpose to understand the companies positioning regarding the market value, volume, and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply a number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders, etc., and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, the analyst team keeps preparing a set of questionnaires, and after getting the appointee list; the target audience is then tapped and segregated with various mediums and channels that are feasible for making connections that including email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey, etc.