Global Flow Soldering Machine Market Overview:
Flow soldering machine is also known as wave soldering machine which is used in the soldering process. The soldering process is performed in a protective gas atmosphere which reduces the defects and mitigates risks of any potential defects. The machine is used in combining the PCB and parts through the liquid wave as a result of motor agitation. It works when the temperature rises at a constant rate and solder paste turns into liquid. The machine consists of a heated tank of solder. Some of the players profiled in the study are Nordson Corporation (United States), Senju Metal Industry Co., Ltd. (Japan), Cobham Mission Systems (United Kingdom), Illinois Tools Works, Inc. (ITW EAE) (United States), KOKI Company Ltd. (Japan), ATT (Romania), Bergen Group of Companies (India) and Estovir Technologies (India).
On the basis of geography, the market of Flow Soldering Machine has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Components, the sub-segment i.e. Conveyor will boost the Flow Soldering Machine market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Soldering Process, the sub-segment i.e. Flux Spraying will boost the Flow Soldering Machine market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Operation, the sub-segment i.e. Semi-automatic will boost the Flow Soldering Machine market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Market Growth Drivers
- Demand for Intelligent Placement Machine in PCB Assembly
- Need for the Productivity and Efficiency in Electronics Components Application
Influencing Trend
- Increasing Use of Flow Soldering Machine for Welding Requirements of Double-sided PCBs
Restraints
- High-Cost Initial Investment Involved in Flow Soldering Machine
Opportunities
- Surging Demand for Flow Soldering Machine in New Device Packaging Methods
- Technological Advancements in the Flow Soldering Machine
Challenges
- Handling and Maintenance Related Problem with Flow Soldering Machine
"A test method to evaluate erosion by molten solder of metallic materials with surface processing, intended for the manufacture of solder baths and other lead-free wave soldering equipment in lead-free soldering, is detailed. The standard aims to prevent accidents or fires by predicting a setup and life of a suitable maintenance cycle."
Target Audience:
Flow Soldering Machine Manufacturers, Flow Soldering Machine International Traders, Flow Soldering Machine Distributors and Suppliers, Research and Development Institutes, Potential Investors, Regulatory Bodies and Others
Major Objectives Focused through this Study
To define, describe, and forecast the Global Flow Soldering Machine market on the basis of product [Lead-free Fow Soldering Machine, Through-hole Technology (THT) Flow Soldering Machine, Dual-in-line Packaging (DIP) Flow Soldering Machine and Others] , application [PCB, Electronic Components, Thermocouples and Others], key regions and end user
To provide in-depth information regarding major influencing factors affecting the growth of the market (trends, drivers, restraints, opportunities, and industry-centric and regional challenges)
To strategically analyse the micro-markets and important business segments with respect to individual growth drivers , market trends and potential, and historical contributions to the total market
Identifying the opportunities in the market for key stakeholders and detailing the competitive landscape for market leaders
To provide market size for various segments of the Flow Soldering Machine market with respect to major geographies, namely, South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico)
To strategically profile the key players and analyzing their market shares and core competencies in the Flow Soldering Machine industry
To track key developments such as product launches, expansions, agreements, partnerships, mergers & acquisitions, and R&D activities that are key factors in shaping the market
Available Customization:
Data related to EXIM [Export- Import], production & consumption by country or regional level break-up can be provided based on client request**. Additionally, the Manufacturers which are also part of the research are .
** Confirmation on availability of data would be informed prior purchase
While framing the research framework, major and emerging players operating in the Flow Soldering Machine market in various regions have been profiled, and their offerings, geographic footprints, and distribution/sales channels have been analysed through in-depth discussions. The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, analyst team keeps preparing set of questionnaires and after getting appointee list; the target audience are then tapped and segregated with various mediums and channels that are feasible for making connection that includes email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey etc.