Global Advanced Packaging

Advanced Packaging Comprehensive Study by Type (Wafer-level Packaging, Bumping, Redistribution Layers, Through-Silicon Vias, Fan-Out WLP, Others), Application (Consumer Electronics, Automotive, Healthcare, Aerospace, Others) Players and Region - Global Market Outlook to 2030

Advanced Packaging Market by XX Submarkets | Forecast Years 2024-2030  

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  • Summary
  • Market Segments
  • Table of Content
  • List of Table & Figures
  • Players Profiled
Advanced Packaging Market Scope
Advanced packaging could be a general grouping of a spread of distinct techniques includes a pair of 5D, 3D-IC, fan-out wafer-level packaging, and system-in-package. Whereas putting multiple chips in a very package has been around for many years, the driving force for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking in conjunction with transistors, and therefore the quantity of distance that a signal has to travel from one finish of a chip over skinny wires is increasing at every node.

AttributesDetails
Study Period2018-2030
Base Year2023
UnitValue (USD Million)
Key Companies ProfiledSamsung Electronics Co., Ltd. (South Korea), Intel Corporation (United States), Advanced Semiconductor Engineering Inc. (Taiwan), Stats Chippac Pte. Ltd. (Singapore), Amkor Technology (United States), Qualcomm Technologies Inc. (United States), Taiwan Semiconductor Manufacturing Company (Taiwan), IBM (United States), Microchip Technology (United States) and Renesas Electronics Corporation (Japan)
CAGR%


Advanced Packaging market companies operating in these industries are focusing more on efficient growth, improvement of operational efficiency and productivity, achieving high safety standards, and focusing on maintaining sustainable development. The market is highly competitive with a few players occupying the major share. The key players are highly focused on developing and innovating new strategies to maintain their market position and customer base. The companies are coming up with partnerships or agreements along with planning strategic activities such as partnerships, product launches, mergers, and acquisitions which will help them to sustain in the market and maintain their competitive edge.

Samsung Electronics Co., Ltd. (South Korea), Intel Corporation (United States), Advanced Semiconductor Engineering Inc. (Taiwan), Stats Chippac Pte. Ltd. (Singapore), Amkor Technology (United States), Qualcomm Technologies Inc. (United States), Taiwan Semiconductor Manufacturing Company (Taiwan), IBM (United States), Microchip Technology (United States) and Renesas Electronics Corporation (Japan) are some of the key players that are part of study coverage. Additionally, the Players which are also part of the research are Texas Instruments (United States) and Analog Devices (United States).

About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from the total available market.

Segmentation Overview
The study have segmented the market of Global Advanced Packaging market by Type , by Application (Consumer Electronics, Automotive, Healthcare, Aerospace and Others) and Region with country level break-up.

On the basis of geography, the market of Advanced Packaging has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). region held largest market share in the year 2023.

Market Leaders and their expansionary development strategies
In November 2022, Lam Research Corp. announced that it has completed the acquisition of SEMSYSCO GmbH with the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI) and other data-intensive applications. Financial terms of the agreement were not disclosed.
In January 2024, Borouge Plc launched five new grades to meet the growing demand in the infrastructure and advanced packaging industries. The launch supports Borouge’s growth and innovation strategy by increasing its market share in the piping market in the company’s core territories


Influencing Trend:
Inclination of Consumer towards Connected Device and IoT Will Lead to the Growth of Semiconductor Packaging is New Market Trend

Market Growth Drivers:
Increase in Demand for Miniaturisation of General Electronic Devices and Improved System Performance With High Working Range Is Driving The Market

Challenges:
Initial High Cost Involved In Setups For Manufacturing Advanced Packaging

Restraints:
IoT being Main Conduct, Data Breach is a threat and can hamper market Growth

Opportunities:
Continuous Compact and Secure Technology Innovation for Newer Device Compatibility and Operating Speeds.

Key Target Audience
Advanced Packaging Manufacturer, Supplier/Distributors, Consumer Electronics, Research Firms and Others

Report Objectives / Segmentation Covered

By Type
  • Wafer-level Packaging
  • Bumping
  • Redistribution Layers
  • Through-Silicon Vias
  • Fan-Out WLP
  • Others
By Application
  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace
  • Others
By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Increase in Demand for Miniaturisation of General Electronic Devices
      • 3.2.2. Improved System Performance With High Working Range Is Driving The Market
    • 3.3. Market Challenges
      • 3.3.1. Initial High Cost Involved In Setups For Manufacturing Advanced Packaging
    • 3.4. Market Trends
      • 3.4.1. Inclination of Consumer towards Connected Device and IoT Will Lead to the Growth of Semiconductor Packaging is New Market Trend
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Advanced Packaging, by Type, Application and Region (value) (2018-2023)
    • 5.1. Introduction
    • 5.2. Global Advanced Packaging (Value)
      • 5.2.1. Global Advanced Packaging by: Type (Value)
        • 5.2.1.1. Wafer-level Packaging
        • 5.2.1.2. Bumping
        • 5.2.1.3. Redistribution Layers
        • 5.2.1.4. Through-Silicon Vias
        • 5.2.1.5. Fan-Out WLP
        • 5.2.1.6. Others
      • 5.2.2. Global Advanced Packaging by: Application (Value)
        • 5.2.2.1. Consumer Electronics
        • 5.2.2.2. Automotive
        • 5.2.2.3. Healthcare
        • 5.2.2.4. Aerospace
        • 5.2.2.5. Others
      • 5.2.3. Global Advanced Packaging Region
        • 5.2.3.1. South America
          • 5.2.3.1.1. Brazil
          • 5.2.3.1.2. Argentina
          • 5.2.3.1.3. Rest of South America
        • 5.2.3.2. Asia Pacific
          • 5.2.3.2.1. China
          • 5.2.3.2.2. Japan
          • 5.2.3.2.3. India
          • 5.2.3.2.4. South Korea
          • 5.2.3.2.5. Taiwan
          • 5.2.3.2.6. Australia
          • 5.2.3.2.7. Rest of Asia-Pacific
        • 5.2.3.3. Europe
          • 5.2.3.3.1. Germany
          • 5.2.3.3.2. France
          • 5.2.3.3.3. Italy
          • 5.2.3.3.4. United Kingdom
          • 5.2.3.3.5. Netherlands
          • 5.2.3.3.6. Rest of Europe
        • 5.2.3.4. MEA
          • 5.2.3.4.1. Middle East
          • 5.2.3.4.2. Africa
        • 5.2.3.5. North America
          • 5.2.3.5.1. United States
          • 5.2.3.5.2. Canada
          • 5.2.3.5.3. Mexico
  • 6. Advanced Packaging: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2023)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. Samsung Electronics Co., Ltd. (South Korea)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. Intel Corporation (United States)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Advanced Semiconductor Engineering Inc. (Taiwan)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. Stats Chippac Pte. Ltd. (Singapore)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. Amkor Technology (United States)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. Qualcomm Technologies Inc. (United States)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. Taiwan Semiconductor Manufacturing Company (Taiwan)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. IBM (United States)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
      • 6.4.9. Microchip Technology (United States)
        • 6.4.9.1. Business Overview
        • 6.4.9.2. Products/Services Offerings
        • 6.4.9.3. Financial Analysis
        • 6.4.9.4. SWOT Analysis
      • 6.4.10. Renesas Electronics Corporation (Japan)
        • 6.4.10.1. Business Overview
        • 6.4.10.2. Products/Services Offerings
        • 6.4.10.3. Financial Analysis
        • 6.4.10.4. SWOT Analysis
  • 7. Global Advanced Packaging Sale, by Type, Application and Region (value) (2025-2030)
    • 7.1. Introduction
    • 7.2. Global Advanced Packaging (Value)
      • 7.2.1. Global Advanced Packaging by: Type (Value)
        • 7.2.1.1. Wafer-level Packaging
        • 7.2.1.2. Bumping
        • 7.2.1.3. Redistribution Layers
        • 7.2.1.4. Through-Silicon Vias
        • 7.2.1.5. Fan-Out WLP
        • 7.2.1.6. Others
      • 7.2.2. Global Advanced Packaging by: Application (Value)
        • 7.2.2.1. Consumer Electronics
        • 7.2.2.2. Automotive
        • 7.2.2.3. Healthcare
        • 7.2.2.4. Aerospace
        • 7.2.2.5. Others
      • 7.2.3. Global Advanced Packaging Region
        • 7.2.3.1. South America
          • 7.2.3.1.1. Brazil
          • 7.2.3.1.2. Argentina
          • 7.2.3.1.3. Rest of South America
        • 7.2.3.2. Asia Pacific
          • 7.2.3.2.1. China
          • 7.2.3.2.2. Japan
          • 7.2.3.2.3. India
          • 7.2.3.2.4. South Korea
          • 7.2.3.2.5. Taiwan
          • 7.2.3.2.6. Australia
          • 7.2.3.2.7. Rest of Asia-Pacific
        • 7.2.3.3. Europe
          • 7.2.3.3.1. Germany
          • 7.2.3.3.2. France
          • 7.2.3.3.3. Italy
          • 7.2.3.3.4. United Kingdom
          • 7.2.3.3.5. Netherlands
          • 7.2.3.3.6. Rest of Europe
        • 7.2.3.4. MEA
          • 7.2.3.4.1. Middle East
          • 7.2.3.4.2. Africa
        • 7.2.3.5. North America
          • 7.2.3.5.1. United States
          • 7.2.3.5.2. Canada
          • 7.2.3.5.3. Mexico
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Advanced Packaging: by Type(USD Million)
  • Table 2. Advanced Packaging Wafer-level Packaging , by Region USD Million (2018-2023)
  • Table 3. Advanced Packaging Bumping , by Region USD Million (2018-2023)
  • Table 4. Advanced Packaging Redistribution Layers , by Region USD Million (2018-2023)
  • Table 5. Advanced Packaging Through-Silicon Vias , by Region USD Million (2018-2023)
  • Table 6. Advanced Packaging Fan-Out WLP , by Region USD Million (2018-2023)
  • Table 7. Advanced Packaging Others , by Region USD Million (2018-2023)
  • Table 8. Advanced Packaging: by Application(USD Million)
  • Table 9. Advanced Packaging Consumer Electronics , by Region USD Million (2018-2023)
  • Table 10. Advanced Packaging Automotive , by Region USD Million (2018-2023)
  • Table 11. Advanced Packaging Healthcare , by Region USD Million (2018-2023)
  • Table 12. Advanced Packaging Aerospace , by Region USD Million (2018-2023)
  • Table 13. Advanced Packaging Others , by Region USD Million (2018-2023)
  • Table 14. South America Advanced Packaging, by Country USD Million (2018-2023)
  • Table 15. South America Advanced Packaging, by Type USD Million (2018-2023)
  • Table 16. South America Advanced Packaging, by Application USD Million (2018-2023)
  • Table 17. Brazil Advanced Packaging, by Type USD Million (2018-2023)
  • Table 18. Brazil Advanced Packaging, by Application USD Million (2018-2023)
  • Table 19. Argentina Advanced Packaging, by Type USD Million (2018-2023)
  • Table 20. Argentina Advanced Packaging, by Application USD Million (2018-2023)
  • Table 21. Rest of South America Advanced Packaging, by Type USD Million (2018-2023)
  • Table 22. Rest of South America Advanced Packaging, by Application USD Million (2018-2023)
  • Table 23. Asia Pacific Advanced Packaging, by Country USD Million (2018-2023)
  • Table 24. Asia Pacific Advanced Packaging, by Type USD Million (2018-2023)
  • Table 25. Asia Pacific Advanced Packaging, by Application USD Million (2018-2023)
  • Table 26. China Advanced Packaging, by Type USD Million (2018-2023)
  • Table 27. China Advanced Packaging, by Application USD Million (2018-2023)
  • Table 28. Japan Advanced Packaging, by Type USD Million (2018-2023)
  • Table 29. Japan Advanced Packaging, by Application USD Million (2018-2023)
  • Table 30. India Advanced Packaging, by Type USD Million (2018-2023)
  • Table 31. India Advanced Packaging, by Application USD Million (2018-2023)
  • Table 32. South Korea Advanced Packaging, by Type USD Million (2018-2023)
  • Table 33. South Korea Advanced Packaging, by Application USD Million (2018-2023)
  • Table 34. Taiwan Advanced Packaging, by Type USD Million (2018-2023)
  • Table 35. Taiwan Advanced Packaging, by Application USD Million (2018-2023)
  • Table 36. Australia Advanced Packaging, by Type USD Million (2018-2023)
  • Table 37. Australia Advanced Packaging, by Application USD Million (2018-2023)
  • Table 38. Rest of Asia-Pacific Advanced Packaging, by Type USD Million (2018-2023)
  • Table 39. Rest of Asia-Pacific Advanced Packaging, by Application USD Million (2018-2023)
  • Table 40. Europe Advanced Packaging, by Country USD Million (2018-2023)
  • Table 41. Europe Advanced Packaging, by Type USD Million (2018-2023)
  • Table 42. Europe Advanced Packaging, by Application USD Million (2018-2023)
  • Table 43. Germany Advanced Packaging, by Type USD Million (2018-2023)
  • Table 44. Germany Advanced Packaging, by Application USD Million (2018-2023)
  • Table 45. France Advanced Packaging, by Type USD Million (2018-2023)
  • Table 46. France Advanced Packaging, by Application USD Million (2018-2023)
  • Table 47. Italy Advanced Packaging, by Type USD Million (2018-2023)
  • Table 48. Italy Advanced Packaging, by Application USD Million (2018-2023)
  • Table 49. United Kingdom Advanced Packaging, by Type USD Million (2018-2023)
  • Table 50. United Kingdom Advanced Packaging, by Application USD Million (2018-2023)
  • Table 51. Netherlands Advanced Packaging, by Type USD Million (2018-2023)
  • Table 52. Netherlands Advanced Packaging, by Application USD Million (2018-2023)
  • Table 53. Rest of Europe Advanced Packaging, by Type USD Million (2018-2023)
  • Table 54. Rest of Europe Advanced Packaging, by Application USD Million (2018-2023)
  • Table 55. MEA Advanced Packaging, by Country USD Million (2018-2023)
  • Table 56. MEA Advanced Packaging, by Type USD Million (2018-2023)
  • Table 57. MEA Advanced Packaging, by Application USD Million (2018-2023)
  • Table 58. Middle East Advanced Packaging, by Type USD Million (2018-2023)
  • Table 59. Middle East Advanced Packaging, by Application USD Million (2018-2023)
  • Table 60. Africa Advanced Packaging, by Type USD Million (2018-2023)
  • Table 61. Africa Advanced Packaging, by Application USD Million (2018-2023)
  • Table 62. North America Advanced Packaging, by Country USD Million (2018-2023)
  • Table 63. North America Advanced Packaging, by Type USD Million (2018-2023)
  • Table 64. North America Advanced Packaging, by Application USD Million (2018-2023)
  • Table 65. United States Advanced Packaging, by Type USD Million (2018-2023)
  • Table 66. United States Advanced Packaging, by Application USD Million (2018-2023)
  • Table 67. Canada Advanced Packaging, by Type USD Million (2018-2023)
  • Table 68. Canada Advanced Packaging, by Application USD Million (2018-2023)
  • Table 69. Mexico Advanced Packaging, by Type USD Million (2018-2023)
  • Table 70. Mexico Advanced Packaging, by Application USD Million (2018-2023)
  • Table 71. Company Basic Information, Sales Area and Its Competitors
  • Table 72. Company Basic Information, Sales Area and Its Competitors
  • Table 73. Company Basic Information, Sales Area and Its Competitors
  • Table 74. Company Basic Information, Sales Area and Its Competitors
  • Table 75. Company Basic Information, Sales Area and Its Competitors
  • Table 76. Company Basic Information, Sales Area and Its Competitors
  • Table 77. Company Basic Information, Sales Area and Its Competitors
  • Table 78. Company Basic Information, Sales Area and Its Competitors
  • Table 79. Company Basic Information, Sales Area and Its Competitors
  • Table 80. Company Basic Information, Sales Area and Its Competitors
  • Table 81. Advanced Packaging: by Type(USD Million)
  • Table 82. Advanced Packaging Wafer-level Packaging , by Region USD Million (2025-2030)
  • Table 83. Advanced Packaging Bumping , by Region USD Million (2025-2030)
  • Table 84. Advanced Packaging Redistribution Layers , by Region USD Million (2025-2030)
  • Table 85. Advanced Packaging Through-Silicon Vias , by Region USD Million (2025-2030)
  • Table 86. Advanced Packaging Fan-Out WLP , by Region USD Million (2025-2030)
  • Table 87. Advanced Packaging Others , by Region USD Million (2025-2030)
  • Table 88. Advanced Packaging: by Application(USD Million)
  • Table 89. Advanced Packaging Consumer Electronics , by Region USD Million (2025-2030)
  • Table 90. Advanced Packaging Automotive , by Region USD Million (2025-2030)
  • Table 91. Advanced Packaging Healthcare , by Region USD Million (2025-2030)
  • Table 92. Advanced Packaging Aerospace , by Region USD Million (2025-2030)
  • Table 93. Advanced Packaging Others , by Region USD Million (2025-2030)
  • Table 94. South America Advanced Packaging, by Country USD Million (2025-2030)
  • Table 95. South America Advanced Packaging, by Type USD Million (2025-2030)
  • Table 96. South America Advanced Packaging, by Application USD Million (2025-2030)
  • Table 97. Brazil Advanced Packaging, by Type USD Million (2025-2030)
  • Table 98. Brazil Advanced Packaging, by Application USD Million (2025-2030)
  • Table 99. Argentina Advanced Packaging, by Type USD Million (2025-2030)
  • Table 100. Argentina Advanced Packaging, by Application USD Million (2025-2030)
  • Table 101. Rest of South America Advanced Packaging, by Type USD Million (2025-2030)
  • Table 102. Rest of South America Advanced Packaging, by Application USD Million (2025-2030)
  • Table 103. Asia Pacific Advanced Packaging, by Country USD Million (2025-2030)
  • Table 104. Asia Pacific Advanced Packaging, by Type USD Million (2025-2030)
  • Table 105. Asia Pacific Advanced Packaging, by Application USD Million (2025-2030)
  • Table 106. China Advanced Packaging, by Type USD Million (2025-2030)
  • Table 107. China Advanced Packaging, by Application USD Million (2025-2030)
  • Table 108. Japan Advanced Packaging, by Type USD Million (2025-2030)
  • Table 109. Japan Advanced Packaging, by Application USD Million (2025-2030)
  • Table 110. India Advanced Packaging, by Type USD Million (2025-2030)
  • Table 111. India Advanced Packaging, by Application USD Million (2025-2030)
  • Table 112. South Korea Advanced Packaging, by Type USD Million (2025-2030)
  • Table 113. South Korea Advanced Packaging, by Application USD Million (2025-2030)
  • Table 114. Taiwan Advanced Packaging, by Type USD Million (2025-2030)
  • Table 115. Taiwan Advanced Packaging, by Application USD Million (2025-2030)
  • Table 116. Australia Advanced Packaging, by Type USD Million (2025-2030)
  • Table 117. Australia Advanced Packaging, by Application USD Million (2025-2030)
  • Table 118. Rest of Asia-Pacific Advanced Packaging, by Type USD Million (2025-2030)
  • Table 119. Rest of Asia-Pacific Advanced Packaging, by Application USD Million (2025-2030)
  • Table 120. Europe Advanced Packaging, by Country USD Million (2025-2030)
  • Table 121. Europe Advanced Packaging, by Type USD Million (2025-2030)
  • Table 122. Europe Advanced Packaging, by Application USD Million (2025-2030)
  • Table 123. Germany Advanced Packaging, by Type USD Million (2025-2030)
  • Table 124. Germany Advanced Packaging, by Application USD Million (2025-2030)
  • Table 125. France Advanced Packaging, by Type USD Million (2025-2030)
  • Table 126. France Advanced Packaging, by Application USD Million (2025-2030)
  • Table 127. Italy Advanced Packaging, by Type USD Million (2025-2030)
  • Table 128. Italy Advanced Packaging, by Application USD Million (2025-2030)
  • Table 129. United Kingdom Advanced Packaging, by Type USD Million (2025-2030)
  • Table 130. United Kingdom Advanced Packaging, by Application USD Million (2025-2030)
  • Table 131. Netherlands Advanced Packaging, by Type USD Million (2025-2030)
  • Table 132. Netherlands Advanced Packaging, by Application USD Million (2025-2030)
  • Table 133. Rest of Europe Advanced Packaging, by Type USD Million (2025-2030)
  • Table 134. Rest of Europe Advanced Packaging, by Application USD Million (2025-2030)
  • Table 135. MEA Advanced Packaging, by Country USD Million (2025-2030)
  • Table 136. MEA Advanced Packaging, by Type USD Million (2025-2030)
  • Table 137. MEA Advanced Packaging, by Application USD Million (2025-2030)
  • Table 138. Middle East Advanced Packaging, by Type USD Million (2025-2030)
  • Table 139. Middle East Advanced Packaging, by Application USD Million (2025-2030)
  • Table 140. Africa Advanced Packaging, by Type USD Million (2025-2030)
  • Table 141. Africa Advanced Packaging, by Application USD Million (2025-2030)
  • Table 142. North America Advanced Packaging, by Country USD Million (2025-2030)
  • Table 143. North America Advanced Packaging, by Type USD Million (2025-2030)
  • Table 144. North America Advanced Packaging, by Application USD Million (2025-2030)
  • Table 145. United States Advanced Packaging, by Type USD Million (2025-2030)
  • Table 146. United States Advanced Packaging, by Application USD Million (2025-2030)
  • Table 147. Canada Advanced Packaging, by Type USD Million (2025-2030)
  • Table 148. Canada Advanced Packaging, by Application USD Million (2025-2030)
  • Table 149. Mexico Advanced Packaging, by Type USD Million (2025-2030)
  • Table 150. Mexico Advanced Packaging, by Application USD Million (2025-2030)
  • Table 151. Research Programs/Design for This Report
  • Table 152. Key Data Information from Secondary Sources
  • Table 153. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Advanced Packaging: by Type USD Million (2018-2023)
  • Figure 5. Global Advanced Packaging: by Application USD Million (2018-2023)
  • Figure 6. South America Advanced Packaging Share (%), by Country
  • Figure 7. Asia Pacific Advanced Packaging Share (%), by Country
  • Figure 8. Europe Advanced Packaging Share (%), by Country
  • Figure 9. MEA Advanced Packaging Share (%), by Country
  • Figure 10. North America Advanced Packaging Share (%), by Country
  • Figure 11. Global Advanced Packaging share by Players 2023 (%)
  • Figure 12. Global Advanced Packaging share by Players (Top 3) 2023(%)
  • Figure 13. Global Advanced Packaging share by Players (Top 5) 2023(%)
  • Figure 14. BCG Matrix for key Companies
  • Figure 15. Samsung Electronics Co., Ltd. (South Korea) Revenue, Net Income and Gross profit
  • Figure 16. Samsung Electronics Co., Ltd. (South Korea) Revenue: by Geography 2023
  • Figure 17. Intel Corporation (United States) Revenue, Net Income and Gross profit
  • Figure 18. Intel Corporation (United States) Revenue: by Geography 2023
  • Figure 19. Advanced Semiconductor Engineering Inc. (Taiwan) Revenue, Net Income and Gross profit
  • Figure 20. Advanced Semiconductor Engineering Inc. (Taiwan) Revenue: by Geography 2023
  • Figure 21. Stats Chippac Pte. Ltd. (Singapore) Revenue, Net Income and Gross profit
  • Figure 22. Stats Chippac Pte. Ltd. (Singapore) Revenue: by Geography 2023
  • Figure 23. Amkor Technology (United States) Revenue, Net Income and Gross profit
  • Figure 24. Amkor Technology (United States) Revenue: by Geography 2023
  • Figure 25. Qualcomm Technologies Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 26. Qualcomm Technologies Inc. (United States) Revenue: by Geography 2023
  • Figure 27. Taiwan Semiconductor Manufacturing Company (Taiwan) Revenue, Net Income and Gross profit
  • Figure 28. Taiwan Semiconductor Manufacturing Company (Taiwan) Revenue: by Geography 2023
  • Figure 29. IBM (United States) Revenue, Net Income and Gross profit
  • Figure 30. IBM (United States) Revenue: by Geography 2023
  • Figure 31. Microchip Technology (United States) Revenue, Net Income and Gross profit
  • Figure 32. Microchip Technology (United States) Revenue: by Geography 2023
  • Figure 33. Renesas Electronics Corporation (Japan) Revenue, Net Income and Gross profit
  • Figure 34. Renesas Electronics Corporation (Japan) Revenue: by Geography 2023
  • Figure 35. Global Advanced Packaging: by Type USD Million (2025-2030)
  • Figure 36. Global Advanced Packaging: by Application USD Million (2025-2030)
  • Figure 37. South America Advanced Packaging Share (%), by Country
  • Figure 38. Asia Pacific Advanced Packaging Share (%), by Country
  • Figure 39. Europe Advanced Packaging Share (%), by Country
  • Figure 40. MEA Advanced Packaging Share (%), by Country
  • Figure 41. North America Advanced Packaging Share (%), by Country
List of companies from research coverage that are profiled in the study
  • Samsung Electronics Co., Ltd. (South Korea)
  • Intel Corporation (United States)
  • Advanced Semiconductor Engineering Inc. (Taiwan)
  • Stats Chippac Pte. Ltd. (Singapore)
  • Amkor Technology (United States)
  • Qualcomm Technologies Inc. (United States)
  • Taiwan Semiconductor Manufacturing Company (Taiwan)
  • IBM (United States)
  • Microchip Technology (United States)
  • Renesas Electronics Corporation (Japan)
Additional players considered in the study are as follows:
Texas Instruments (United States) , Analog Devices (United States)
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May 2024 201 Pages 65 Tables Base Year: 2023 Coverage: 15+ Companies; 18 Countries

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Global Advanced Packaging Quantitative research analysis
Global Advanced Packaging Qualitative Industry Analysis
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Frequently Asked Questions (FAQ):

The key segments that are playing vital role in Advanced Packaging Market are by type [Wafer-level Packaging, Bumping, Redistribution Layers, Through-Silicon Vias, Fan-Out WLP and Others], by end use application [Consumer Electronics, Automotive, Healthcare, Aerospace and Others].
The Advanced Packaging Market is gaining popularity and expected to see strong valuation by 2030.
  • Increase in Demand for Miniaturisation of General Electronic Devices
  • Improved System Performance With High Working Range Is Driving The Market

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