The article cited AMA's Global System in Package Technology Market Study explored significant growth with CAGR of 12.15%. According to the report, Trend for Miniaturization is one of the primary growth factors for the market. Demand For System Flexibility, Features, And Configurability is also expected to contribute significantly to the System in Package Technology market. Overall, Consumer Electronics applications of System in Package Technology, and the growing awareness of them, is what makes this segment of the industry important to its overall growth. New players are beginning to enter the market and established companies have been changing their business models – a trend that will continue in the future.

AMA’s Analyst on the Global System in Package Technology Market identified that the demand is rising in many different parts of the world due to "Growing Integration of System in Package Technology for IoT and IoE Applications ". Furthermore, some recent industry insights like "In March 2019, Qualcomm Technologies collaborated with ASUS and launched ASUS Zenfone Max Shot and Zenfone Max Plus (M2) smartphones with the Qualcomm Snapdrago System in Package (SiP) 1." is constantly making the industry dynamic. One of the challenges that industry facing is "Lack of Physical Layout Information"

The report provides an in-depth analysis and forecast about the industry covering the following key features:
o Industry outlook including current and future market trends, drivers, restraints, and emerging technologies
o Analyses the Global System in Package Technology market according to Type, Application, and regions
o Analyzes the top 10 players in terms of market reach, business strategy, and business focus
o Provides stakeholders’ insights and key drivers & trends of the market

Market Size Estimation
In market engineering method, both top-down and bottom-up approaches have been used, along with various data triangulation process, to predict and validate the market size of the System in Package Technology market and other related sub-markets covered in the study.

o Key & emerging players in the System in Package Technology market have been observed through secondary research.
o The industry’s supply chain and overall market size, in terms of value, have been derived through primary and secondary research processes.
o All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.

Data Triangulation
The overall System in Package Technology market size is calculated using market estimation process, the System in Package Technology market was further split into various segments and sub-segments. To complete the overall market engineering and arriving at the exact statistics for all segments and sub-segments, the market breakdown and data triangulation procedures have been utilized, wherever applicable. The data have been triangulated by studying various influencing factors and trends identified from both demand and supply sides of various applications involved in the study. Along with this, the Global System in Package Technology market size has been validated using both top-down and bottom-up approaches.