AdvanceMarketAnalytics, a global market research and consulting organization, have released a new study titled "Flip Chip market - Global outlook to 2026".
Industries constant focus on reducing the operational cost and increased attention on core business, and need to improve scalability are expected to shape the Global Flip Chip market to grow at a CAGR of 6.41% to aggregate USD48.0 Billion by 2026.

The Bumping Technology, such as Copper Pilar, is boosting the Flip Chip market. Additionally, the rising demand from SMEs and various industry verticals, macro-economic growth are the prime factors driving the growth of the market.

The Packaging Technology, such as 2D IC, is boosting the Flip Chip market. Additionally, the rising demand from SMEs and various industry verticals, macro-economic growth are the prime factors driving the growth of the market.

According to Analyst at AMA Research, the Global Flip Chip market will experience significant growth during the forecast period due to potential opportunities lying in the market such as . Some of the important driving forces are “Increasing Demand for Miniaturization and High-Performing Electronic Devices and Surging Demand in Numerous Industry”.
 

Flip Chip, also known as direct chip attach, is a process which interconnects chip and package carriers or substrate using a conductive bump. Once the die is connected the stand-off distance between the die and substrate is typically filled with a non-conductive adhesive referred to as underfill. Increasing demand due to the advancement in copper pillar and micro bumping metallurgy and its extended use in consumer electronics products and mobile phones experiencing a high market growth.

The report provides an in-depth analysis and forecast about the industry covering the following key features:
o Industry outlook including current and future market trends, drivers, restraints, and emerging technologies
o Analyses the Global Flip Chip market by Type (Memory, High Brightness, Light-Emitting Diode (LED), RF, Power and Analog ICs, Imaging and 2D Logic Soc), by Application (Medical Devices, Industrial Applications, Automotive, Aerospace & Defence, Telecommunication, Electronic Devices and Others) and major geographies with country level break-up that includes South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico).
o Analyzes the top 10 players in terms of market reach, business strategy, and business focus
o Provides stakeholders’ insights and key trends (current and future) of the market